• DocumentCode
    1762264
  • Title

    Hybrid Silicon Photonic Integrated Circuit Technology

  • Author

    Heck, Martijn J. R. ; Bauters, J.F. ; Davenport, Michael L. ; Doylend, J.K. ; Jain, Sonal ; Kurczveil, G. ; SRINIVASAN, SUDARSHAN ; Yongbo Tang ; Bowers, John E.

  • Author_Institution
    Univ. of California Santa Barbara, Santa Barbara, CA, USA
  • Volume
    19
  • Issue
    4
  • fYear
    2013
  • fDate
    July-Aug. 2013
  • Firstpage
    6100117
  • Lastpage
    6100117
  • Abstract
    In this paper, we review the current status of the hybrid silicon photonic integration platform with emphasis on its prospects for increased integration complexity. The hybrid silicon platform is maturing fast as increasingly complex circuits are reported with tens of integrated components including on-chip lasers. It is shown that this platform is well positioned and holds great potential to address future needs for medium-scale photonic integrated circuits.
  • Keywords
    elemental semiconductors; integrated optoelectronics; reviews; silicon; Si; complex circuits; hybrid silicon photonic integrated circuit; integrated components; integration complexity; medium-scale photonic integrated circuits; on-chip lasers; photonic integration; Modulation; Optical waveguides; Photonic band gap; Photonics; Silicon; Wafer bonding; Hybrid silicon platform; integrated optoelectronics; optoelectronic devices; semiconductor lasers; silicon photonics; silicon-on-insulator (SOI) technology;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/JSTQE.2012.2235413
  • Filename
    6387568