DocumentCode
1762264
Title
Hybrid Silicon Photonic Integrated Circuit Technology
Author
Heck, Martijn J. R. ; Bauters, J.F. ; Davenport, Michael L. ; Doylend, J.K. ; Jain, Sonal ; Kurczveil, G. ; SRINIVASAN, SUDARSHAN ; Yongbo Tang ; Bowers, John E.
Author_Institution
Univ. of California Santa Barbara, Santa Barbara, CA, USA
Volume
19
Issue
4
fYear
2013
fDate
July-Aug. 2013
Firstpage
6100117
Lastpage
6100117
Abstract
In this paper, we review the current status of the hybrid silicon photonic integration platform with emphasis on its prospects for increased integration complexity. The hybrid silicon platform is maturing fast as increasingly complex circuits are reported with tens of integrated components including on-chip lasers. It is shown that this platform is well positioned and holds great potential to address future needs for medium-scale photonic integrated circuits.
Keywords
elemental semiconductors; integrated optoelectronics; reviews; silicon; Si; complex circuits; hybrid silicon photonic integrated circuit; integrated components; integration complexity; medium-scale photonic integrated circuits; on-chip lasers; photonic integration; Modulation; Optical waveguides; Photonic band gap; Photonics; Silicon; Wafer bonding; Hybrid silicon platform; integrated optoelectronics; optoelectronic devices; semiconductor lasers; silicon photonics; silicon-on-insulator (SOI) technology;
fLanguage
English
Journal_Title
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
1077-260X
Type
jour
DOI
10.1109/JSTQE.2012.2235413
Filename
6387568
Link To Document