Title :
Role of the Hafnium Dioxide Spacer in the ZnO-Based Planar Schottky Diodes Obtained by the Low-Temperature Atomic Layer Deposition Method: Investigations of Current-Voltage Characteristics
Author :
Zakrzewski, Adam J. ; Krajewski, Tomasz A. ; Luka, Grzegorz ; Goscinski, Krzysztof ; Guziewicz, Elzbieta ; Godlewski, Marek
Author_Institution :
Dept. of Math. & Natural Sci., Cardinal Stefan Wyszynski Univ. in Warsaw, Warsaw, Poland
Abstract :
This paper reports on results of modeling of current-voltage characteristics of the Ag/ZnO/TiAu planar Schottky diodes containing interfacial layer of hafnium dioxide (HfO2) with thickness ranging from 1.25 to 7.5 nm. It was found that forward characteristics can be described with thermionic emission theory. In this way, values of some relevant diodes´ parameters were determined, including the ideality factor and the effective Schottky barrier height. We found a satisfactory agreement of experimental and theoretical results for most diodes, with exception of the one with a 7.5-nm thick layer. It was found that a 2.5-nm thick HfO2 spacer between ZnO and silver contact yields the highest effective Schottky barrier height (~0.7 eV) accompanied by a pronounced rectification ratio (reaching 7 × 102 at ±2.5 V) of the examined planar structure.
Keywords :
II-VI semiconductors; Schottky diodes; atomic layer deposition; hafnium compounds; high-k dielectric thin films; semiconductor device models; silver; thermionic emission; titanium compounds; wide band gap semiconductors; zinc compounds; Ag-ZnO-TiAu; HfO2; current-voltage characteristics; effective Schottky barrier height; forward characteristics; hafnium dioxide spacer; ideality factor; interfacial layer; low-temperature atomic layer deposition method; planar Schottky diodes; rectification ratio; silver contact yields; size 1.25 nm to 7.5 nm; thermionic emission theory; Atomic layer deposition; Hafnium compounds; Junctions; Schottky barriers; Schottky diodes; Zinc oxide; Schottky diode; semiconductor device modeling; semiconductor-insulator interfaces; semiconductor-insulator interfaces.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2376979