Title :
45-nm CMOS SOI Technology Characterization for Millimeter-Wave Applications
Author :
Inac, Ozgur ; Uzunkol, Mehmet ; Rebeiz, Gabriel M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California at San Diego, La Jolla, CA, USA
Abstract :
This paper presents an in-depth study of a 45-nm CMOS silicon-on-insulator (SOI) technology. Several transistor test cells are characterized and the effect of finger width, gate contact, and gate poly pitch on transistor performance is analyzed. The measured peak ft is 264 GHz for a 30 × 1007 nm single-gate contact relaxed-pitch transistor and the best fmax of 283 GHz is achieved by a 58 × 513 nm single-gate contact regular pitch transistor. The measured transistor performance agrees well with the simulations including R/C extraction up to the top metal layer. Passive components are also characterized and their performance is predicted accurately with design kit models and electromagnetic simulations. Low-noise amplifiers from Q- to W-band are developed in this technology and they achieve state-of-the-art noise-figure values.
Keywords :
CMOS integrated circuits; low noise amplifiers; millimetre wave amplifiers; millimetre wave integrated circuits; passive networks; silicon-on-insulator; CMOS SOI technology; CMOS silicon-on-insulator technology; Q-band; R/C extraction; W-band; design kit models; electromagnetic simulations; finger width effect; frequency 264 GHz; frequency 283 GHz; gate poly pitch; low-noise amplifiers; millimeter-wave applications; passive components; single-gate contact regular pitch transistor; single-gate contact relaxed-pitch transistor; size 1007 nm; size 30 nm; size 45 nm; size 513 nm; size 58 nm; top metal layer; transistor performance; transistor test cells; CMOS integrated circuits; Logic gates; Metals; Millimeter wave technology; Semiconductor device modeling; Transistors; Transmission line measurements; 45-nm CMOS; low-noise amplifiers (LNAs); millimeter wave; silicon-on-insulator (SOI);
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2014.2317551