Title :
Highly Reliable Reference Bitline Bias Designs for 64 Mb and 128 Mb Chain FeRAMs
Author :
Ogiwara, Ryu ; Takashima, Daisaburo ; Doumae, Sumiko ; Shiratake, Shinichiro ; Takizawa, Ryousuke ; Shiga, Hidehiro
Author_Institution :
Center for Semicond. R&D, Toshiba Corp., Yokohama, Japan
Abstract :
This paper presents highly reliable reference bitline bias designs for 64 Mb and 128 Mb chain FeRAM™. The hysteresis shape deformation of ferroelectric capacitor due to temperature variation causes cell signal level shifts of both “1” and “0” data. The reference bitline bias of 64 Mb chip is designed to keep intermediate value of “1” and “0” data at any operating temperatures from -40°C to 85 °C by introducing a modified band-gap reference circuit with 3 bit temperature coefficient trimmers and 6 bit digital-to-analog converter (DAC) using laser fuses. The measured result shows the improvement of tail-to-tail cell signal windows by ±22 mV. Moreover, a new reference bias circuit called the “elevator circuit” with 3 bit temperature coefficient trimmers using ferroelectric fuses installed in a 128 Mb chip compensates array operating voltage VAA fluctuation as well as temperature variation. The elevator circuit enables the temperature dependency control at low external VDD of 1.8 V. This improves cell signal window by ±40 mV. The elevator circuit also varies reference bitline bias with array operating voltage VAA variation, resulting in improvement of cell signal windows by ±44 mV in the range of 1.5 V ±0.2 V VAA.
Keywords :
digital-analogue conversion; ferroelectric storage; integrated circuit design; integrated circuit reliability; random-access storage; DAC; FeRAM; VAA variation; array operating voltage fluctuation; cell signal level shifts; cell signal window improvement; digital-to-analog converter; elevator circuit; ferroelectric capacitor; highly-reliable reference bitline bias design; hysteresis shape deformation; laser fuses; modified band-gap reference circuit; reference bias circuit; reference bitline bias; tail-to-tail cell signal windows; temperature -40 degC to 85 degC; temperature coefficient trimmers; temperature dependency control; temperature variation; word length 3 bit; word length 6 bit; Ferroelectric films; Nonvolatile memory; Random access memory; Semiconductor device measurement; Temperature distribution; Temperature measurement; Voltage measurement; BGR; FeRAM; ferroelectric memory; hysteresis; reference voltage; temperature;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2015.2405932