DocumentCode :
1762558
Title :
Lateral p-n-p Transistors and Complementary SiC Bipolar Technology
Author :
Lanni, Luigia ; Malm, B. Gunnar ; Ostling, Mikael ; Zetterling, Carl-Mikael
Author_Institution :
Sch. of Inf. & Commun. Technol., KTH R. Inst. of Technol., Kista, Sweden
Volume :
35
Issue :
4
fYear :
2014
fDate :
41730
Firstpage :
428
Lastpage :
430
Abstract :
Lateral p-n-p transistors and a complementary bipolar technology have been demonstrated for analog integrated circuits. Besides vertical n-p-n´s, this technology provides lateral p-n-p´s at the cost of one additional lithographic and dry etching step. Both devices share the same epitaxial layers and feature topside contacts to all terminals. The influence on p-n-p current gain of contact topology (circular versus rectangular), effective base width, base/emitter doping ratio, and temperature was studied in detail. In the range -40°C to 300 °C, the current gain of the p-n-p transistor shows a maximum of ~ 37 around 0 °C and decreases to ~ 8 at 300 °C, whereas in the same range, the gain of n-p-n transistors exhibits a negative temperature coefficient.
Keywords :
bipolar transistors; epitaxial layers; etching; lithography; silicon compounds; wide band gap semiconductors; SiC; analog integrated circuits; base-emitter doping ratio; complementary bipolar technology; contact topology; current gain temperature dependence; dry etching; epitaxial layers; lateral p-n-p transistors; lithography; negative temperature coefficient; temperature -40 degC to 300 degC; topside contacts; Current measurement; Doping; Epitaxial layers; Silicon carbide; Temperature dependence; Topology; Transistors; Bipolar junction transistor (BJT); complementary bipolar; current gain temperature dependence; high and low temperature; lateral PNP transistor; silicon carbide (SiC);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2303395
Filename :
6737263
Link To Document :
بازگشت