• DocumentCode
    1762686
  • Title

    Dynamic Thermal Management Under Soft Thermal Constraints

  • Author

    Bing Shi ; Yufu Zhang ; Srivastava, Anurag

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
  • Volume
    21
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    2045
  • Lastpage
    2054
  • Abstract
    In this paper, we investigate dynamic thermal management (DTM) policies under soft thermal constraint that allow the thermal constraint to be violated occasionally for boosting system performance. First, we investigate soft-constraint DTM using lumped radio control (RC) thermal models. We develop analytical expressions for the optimal core frequency policies that maximize overall performance under soft thermal constraint for both single-core and homogeneous multicore processors. We then generalize the problem to heterogeneous multicore processor and use a more accurate distributed RC thermal model to account for the spatial thermal variation. The generalized problem also takes into account the impact of increased temperature on transistor delay and leakage power. The problem is solved by convex optimization. Experimental results indicate that for a two-core processor, a mere 10 °C increase in the core temperature for 100 s results in about 30% performance gain.
  • Keywords
    convex programming; microprocessor chips; thermal management (packaging); DTM policy; convex optimization; distributed RC thermal model; dynamic thermal management; heterogeneous multicore processor; leakage power; lumped radio control thermal model; optimal core frequency policy; soft thermal constraint; spatial thermal variation; transistor delay; two-core processor; Frequency control; Multicore processing; Program processors; Resistance; Switches; Thermal management; Time frequency analysis; Dynamic thermal management; frequency scaling; single and multicore processors; soft thermal constraint;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2012.2227854
  • Filename
    6387626