• DocumentCode
    1762743
  • Title

    Aluminum-Based Rear-Side PVD Metallization for nPERT Silicon Solar Cells

  • Author

    Katkhouda, Kamal ; Martinez-Limia, Alberto ; Bornschein, Lutz ; Koseva, Radinka ; Geppert, Torsten ; Grohe, Andreas ; Krokoszinski, Hans-Joachim ; Schaaf, P.

  • Author_Institution
    Bosch Solar Energy, Arnstadt, Germany
  • Volume
    4
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan. 2014
  • Firstpage
    160
  • Lastpage
    167
  • Abstract
    This paper presents the results of a detailed study on Al-based physical vapor deposition metallization for the rear side of nPERT silicon solar cells. Pure Al is compared with a barrier metallization (Al-Si/Al or Ti/Al) in terms of spiking, contact formation and back-side reflection. A degradation of cell performance with pure Al rear-side metallization due to Al spiking after thermal annealing is observed. This can be avoided either by using a spiking barrier or by using a sufficiently deep doping profile. In addition, all metallization schemes have a sufficiently low specific contact resistance <;0.2 mΩ·cm2 on n+-Si with a sheet resistance of ~75 Ω/sq. Furthermore, the widely used front-side contact metal Ti leads to a significant short-circuit current density loss of more than 0.3 mA/cm2 when applied to the rear side of a silicon solar cell due to its low reflectivity of infrared wavelengths.
  • Keywords
    aluminium; annealing; contact resistance; current density; doping profiles; elemental semiconductors; reflectivity; semiconductor device metallisation; silicon; solar cells; titanium; vapour deposition; Al; Al-Si-Al; Si; Ti-Al; aluminum-based rear-side PVD metallization; back-side reflection; barrier metallization; contact formation; contact resistance; deep doping profile; infrared wavelength reflectivity; nPERT silicon solar cells; physical vapor deposition metallization; sheet resistance; short-circuit current density loss; spiking barrier; thermal annealing; Annealing; Contact resistance; Metallization; Photovoltaic cells; Resistance; Silicon; Metallization; physical vapor deposition (PVD); rear totally diffused (PERT); silicon solar cell;
  • fLanguage
    English
  • Journal_Title
    Photovoltaics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    2156-3381
  • Type

    jour

  • DOI
    10.1109/JPHOTOV.2013.2288018
  • Filename
    6670052