• DocumentCode
    1763029
  • Title

    Improvement of Electrical Properties in a Novel Partially Depleted SOI MOSFET With Emphasizing on the Hysteresis Effect

  • Author

    Anvarifard, Mohammad K. ; Orouji, Ali Asghar

  • Author_Institution
    Electr. & Comput. Eng. Dept., Semnan Univ., Semnan, Iran
  • Volume
    60
  • Issue
    10
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    3310
  • Lastpage
    3317
  • Abstract
    A novel structure is presented to suppress the hysteresis effect due to the floating body effect (FBE) in a partially depleted silicon-on-insulator (SOI) MOSFET. The proposed structure, including a Si1-xGex tunnel diode on the source side, provides a proper path for transferring the accumulated holes in order to diminish the FBE. Indeed, the SiGe tunnel diode can be introduced as a body contact for the proposed structure. The new structure, named the SiGe tunnel diode body contact SOI (SG-TDBC SOI), is compared with a conventional SOI MOSFET (C-SOI) structure. Also, the proposed structure improves other main characteristics such as short channel effects, breakdown voltage, subthreshold swing, gate-induced floating body effect and gate-induced drain leakage. Extracted numerical results show that the SG-TDBC SOI structure can be considered as a candidate to replace the conventional SOI structure.
  • Keywords
    Ge-Si alloys; MOSFET; hysteresis; silicon-on-insulator; tunnel diodes; FBE; SG-TDBC SOI; Si1-xGex; body contact; breakdown voltage; electrical properties; gate-induced drain leakage; gate-induced floating body effect; hysteresis effect; partially depleted SOI MOSFET; short channel effect; silicon-on-insulator MOSFET; subthreshold swing; tunnel diode; Current density; Hysteresis; Logic gates; MOSFET; Semiconductor diodes; Silicon germanium; Threshold voltage; Floating body effect (FBE); SiGe tunnel diode; hysteresis effect; silicon-on-insulator (SOI);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2278627
  • Filename
    6587090