DocumentCode :
1763426
Title :
Equi-Reflectance Dual Mode Resonance Using Bimetallic Loaded Dielectric Plasmonic Structure
Author :
Bera, Mahua ; Ray, Mina
Author_Institution :
Dept. of Appl. Opt. & Photonics, Univ. of Calcutta, Kolkata, India
Volume :
25
Issue :
20
fYear :
2013
fDate :
Oct.15, 2013
Firstpage :
1965
Lastpage :
1968
Abstract :
Theoretical study of the reflectance response of an asymmetrically-clad bimetallic film that supports coupled surface plasmon polariton modes has been presented. Through adjusting the relative thickness of the two metal film components, the relative coupling strength to the long range (LR) and short range plasmon modes can be altered. It is possible to obtain optimal and equi coupling (zero reflectivity) to both modes for given incident wavelength by further adjusting the overall thickness of bimetallic film. Simultaneous angular and spectral sensitivity calculations of resonance of the LR mode have been demonstrated for sensing application. Tailoring of the structure of individual metal films realizing equi- and non-equi-reflectance modes has been proposed which may further be used for plasmonic trinary logic using binary di-bit images.
Keywords :
infrared spectra; logic circuits; metallic thin films; plasmonics; polaritons; surface plasmon resonance; LR mode; angular sensitivity; asymmetrically-clad bimetallic film; bimetallic loaded dielectric plasmonic structure; binary di-bit images; equi coupling; equi-reflectance dual mode resonance; film thickness; long range plasmon mode; nonequi-reflectance modes; optimal coupling; plasmonic trinary logic; reflectance response; relative coupling strength; relative thickness; sensing application; short range plasmon mode; spectral sensitivity; surface plasmon polariton modes; zero reflectivity; Dielectrics; Films; Metals; Optical surface waves; Plasmons; Reflectivity; Sensitivity; Plasmonics; bimetallic; thin films;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2013.2279685
Filename :
6587135
Link To Document :
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