Title :
Failure Analysis of Superjunction VDMOS Under UIS Condition
Author :
Jing Zhu ; Weifeng Sun ; Yifan Wu ; Shengli Lu ; Yangbo Yi
Author_Institution :
ASIC Syst. Eng. Res. Center, Southeast Univ., Nanjing, China
Abstract :
The failure mechanisms for two kinds of the 750-V Superjunction VDMOS (SJ-VDMOS) devices with different charge imbalance conditions (Qp <; Qn and Qp > Qn) under unclamped inductive switching (UIS) condition are investigated in detail by experiments and 2-D devices simulations in this paper. For Qp <; Qn, only the channel current appears in the device during the UIS turn-off process, and the avalanche current appears after the device turns off. Finally, the parasitic transistor of the device is triggered when the drain voltage reaches the BVOFF, so the device fails. Unlike Qp <; Qn, the SJ-VDMOS device fails before its drain voltage reaches the BVOFF for the condition of Qp > Qn. Not only the channel current but also the avalanche current caused by ON-state breakdown appears during the UIS turn-off process until the gate voltage decreases below the threshold voltage in the SJ-VDMOS device. The avalanche current flows beneath the n+ region and leads to the activation of the parasitic transistor.
Keywords :
MOSFET; failure analysis; semiconductor device reliability; semiconductor junctions; 2D device simulations; ON-state breakdown; SJ-VDMOS devices; UIS turn-off process; avalanche current; channel current; failure analysis; parasitic transistor; superjunction VDMOS; superjunction vertical diffused metal-oxide semiconductor transistor; unclamped inductive switching condition; voltage 750 V; Charge imbalance; Failure analysis; Inductive switching; Semiconductor devices; Avalanche robust; charge imbalance; superjunction vertical diffused metal–oxide semiconductor (VDMOS); unclamped inductive switching (UIS);
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2013.2267744