• DocumentCode
    1764802
  • Title

    How to Respond to Process Module Failure in Residency Time-Constrained Single-Arm Cluster Tools

  • Author

    Yan Qiao ; NaiQi Wu ; ChunRong Pan ; Mengchu Zhou

  • Author_Institution
    Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • Volume
    27
  • Issue
    4
  • fYear
    2014
  • fDate
    Nov. 2014
  • Firstpage
    462
  • Lastpage
    474
  • Abstract
    Cyclic scheduling and operation of a residency time-constrained single-arm cluster tool with failure-prone process modules are highly challenging. In some cases, when a failure occurs, there still exists a feasible cyclic schedule for the performance-degraded tool. In other cases, such a schedule no longer exists. For the latter, it is highly desired to respond to a process module failure properly such that the tool can continue working and the wafers in the tool can be completed in a feasible way. This work is the first one to study this important issue. The idea is to apply Petri nets to describe the dynamic behavior of a single-arm cluster tool. With the developed Petri net model, this paper formulates failure response policies to control the cluster tool such that it can keep working without violating any residency time constraint. The failure response policies are implemented via efficient real-time control laws. Illustrative examples are presented to show their usage.
  • Keywords
    Petri nets; failure analysis; scheduling; semiconductor device manufacture; Petri nets; cyclic scheduling; failure response policies; failure-prone process modules; performance-degraded tool; process module failure; residency time constraint; residency time-constrained single-arm cluster tool; Petri nets; Real-time systems; Robots; Scheduling; Semiconductor device manufacture; Steady-state; Time factors; Cluster tools; Failure response; Petri net; Scheduling; Wafer fabrication;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2014.2340858
  • Filename
    6860284