DocumentCode
1764919
Title
A Component-Level Radio-Frequency Interference Evaluation Method for Mobile Devices
Author
Eakhwan Song ; Hyun Ho Park
Author_Institution
Global Production Technol. Center, Samsung Electron. Co., Ltd., Suwon, South Korea
Volume
55
Issue
6
fYear
2013
fDate
Dec. 2013
Firstpage
1358
Lastpage
1361
Abstract
In this letter, a radio-frequency interference (RFI) evaluation method for highly integrated mobile devices, such as smartphones and tablets, is proposed. A near-field specification for noise-emitting components in mobile devices is developed based on near-field emission measurements and RF sensitivity measurements of mobile devices with the bit-error-rate (BER) test. To devise the specification, a derivative relation between the near-field strength of noise sources and the system-level RF sensitivity is newly suggested using the theoretical relationship between the signal to interference and noise ratio and the probability of error in communication systems, and verified with empirical measurements. Using the proposed algorithm, an RFI evaluation specification for commercial camera modules widely used in modern smartphones was established at several RF communication bands.
Keywords
error statistics; mobile handsets; radiofrequency interference; sensitivity; BER test; RF sensitivity measurements; RFI evaluation method; bit-error-rate test; commercial camera modules; communication systems; component-level radiofrequency interference evaluation method; empirical measurements; error probability; mobile devices; near-field emission measurements; noise-emitting components; signal to interference and noise ratio; smartphones; system-level sensitivity; tablets; Cameras; Interference; Mobile handsets; Noise; Noise measurement; Radio frequency; Sensitivity; Component; RFI evaluation; mobile device; radio-frequency interference (RFI); radio-frequency sensitivity; specification;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2013.2265333
Filename
6530624
Link To Document