SiGe Process Integrated On-Chip Dipole Antenna on Finite-Size Ground Plane

Author

Seyyed-Esfahlan, Mehdi ; Kaynak, Mehmet ; Gottel, B. ; Tekin, Ibrahim

Author_Institution

Dept. of Electron. Eng., Sabanci Univ., Istanbul, Turkey

Volume

12

fYear

2013

fDate

2013

Firstpage

1260

Lastpage

1263

Abstract

This letter investigates the effect of a finite-size ground plane on the radiation pattern and reflection coefficient of a SiGe process integrated on-chip antenna. A flat 77-GHz on-chip strip dipole antenna integrated with a lumped LC balun circuit is designed and implemented. For increased directivity, the etched silicon substrate is placed on a metal ground plate. The on-chip antenna with the LC balun circuit is connected to GSG pads for measurement purposes. The antenna is well matched at the original resonance frequency band with 7-12 GHz impedance bandwidth and 4 dBi measured gain at 85 GHz.

Keywords

antenna radiation patterns; baluns; dipole antennas; etching; germanium compounds; lumped parameter networks; millimetre wave antennas; silicon compounds; substrate integrated waveguides; GSG pads; bandwidth 7 GHz to 12 GHz; bandwidth 77 GHz; etched silicon substrate; finite-size ground plane; gain 85 dB; impedance bandwidth; lumped LC balun circuit; metal ground plate; millimeter-wave radar; radiation pattern; reflection coefficient; resonance frequency band; silicon-germanium process integrated on-chip dipole antenna; Antenna measurements; Antenna radiation patterns; Dipole antennas; Frequency measurement; Gain; Impedance matching; Reflection coefficient; 77-GHz on-chip antenna; GSG pad; antenna on finite ground plane; millimeter-wave radar;

fLanguage

English

Journal_Title

Antennas and Wireless Propagation Letters, IEEE

Publisher

ieee

ISSN

1536-1225

Type

jour

DOI

10.1109/LAWP.2013.2282971

Filename

6605531