Title :
SiGe Process Integrated On-Chip Dipole Antenna on Finite-Size Ground Plane
Author :
Seyyed-Esfahlan, Mehdi ; Kaynak, Mehmet ; Gottel, B. ; Tekin, Ibrahim
Author_Institution :
Dept. of Electron. Eng., Sabanci Univ., Istanbul, Turkey
Abstract :
This letter investigates the effect of a finite-size ground plane on the radiation pattern and reflection coefficient of a SiGe process integrated on-chip antenna. A flat 77-GHz on-chip strip dipole antenna integrated with a lumped LC balun circuit is designed and implemented. For increased directivity, the etched silicon substrate is placed on a metal ground plate. The on-chip antenna with the LC balun circuit is connected to GSG pads for measurement purposes. The antenna is well matched at the original resonance frequency band with 7-12 GHz impedance bandwidth and 4 dBi measured gain at 85 GHz.
Keywords :
antenna radiation patterns; baluns; dipole antennas; etching; germanium compounds; lumped parameter networks; millimetre wave antennas; silicon compounds; substrate integrated waveguides; GSG pads; bandwidth 7 GHz to 12 GHz; bandwidth 77 GHz; etched silicon substrate; finite-size ground plane; gain 85 dB; impedance bandwidth; lumped LC balun circuit; metal ground plate; millimeter-wave radar; radiation pattern; reflection coefficient; resonance frequency band; silicon-germanium process integrated on-chip dipole antenna; Antenna measurements; Antenna radiation patterns; Dipole antennas; Frequency measurement; Gain; Impedance matching; Reflection coefficient; 77-GHz on-chip antenna; GSG pad; antenna on finite ground plane; millimeter-wave radar;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2013.2282971
