• DocumentCode
    1765368
  • Title

    Realization of a Modular Indirect Matrix Converter System Using Normally Off SiC JFETs

  • Author

    Escobar-Mejia, Andres ; Stewart, Craig ; Hayes, Jonathan K. ; Ang, Simon S. ; Balda, Juan Carlos ; Talakokkula, Saikishore

  • Author_Institution
    La Univ. Tecnol. de Pereira, Pereira, Colombia
  • Volume
    29
  • Issue
    5
  • fYear
    2014
  • fDate
    41760
  • Firstpage
    2574
  • Lastpage
    2583
  • Abstract
    Silicon carbide (SiC) semiconductors are becoming the preferable choice over silicon (Si) semiconductors for power converter applications within the 200 V to 1.2 kV range due to their superior performances. Indirect matrix converters (IMCs) have more potential than traditional back-to-back power converters (BBCs) for achieving higher power densities and longer equipment lifetimes. This paper combines normally off SiC JFETs and the IMC topology to develop a module-based IMC system whose power stage consists of a bidirectional rectifier power module (BPM) and an inverter power module. This combination achieves a power density of approximately 72 kVA/L at the module level. A 5-kVA IMC prototype operating at a switching frequency of 30 kHz and connected to an RL load demonstrates the functionality of the proposed modular IMC system.
  • Keywords
    invertors; junction gate field effect transistors; matrix convertors; power semiconductor devices; rectifiers; silicon compounds; wide band gap semiconductors; IMC topology; JFET; SiC; back to back power converters; bidirectional rectifier power module; frequency 30 kHz; higher power densities; inverter power module; longer equipment lifetimes; modular indirect matrix converter system; module based IMC system; power converter applications; power stage; voltage 200 V to 1.2 kV; Inverters; JFETs; Logic gates; Matrix converters; Silicon carbide; Switches; Voltage control; Indirect matrix converter (IMC); parasitic inductance; silicon carbide (SiC) JFET;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2013.2290542
  • Filename
    6670802