DocumentCode :
1765368
Title :
Realization of a Modular Indirect Matrix Converter System Using Normally Off SiC JFETs
Author :
Escobar-Mejia, Andres ; Stewart, Craig ; Hayes, Jonathan K. ; Ang, Simon S. ; Balda, Juan Carlos ; Talakokkula, Saikishore
Author_Institution :
La Univ. Tecnol. de Pereira, Pereira, Colombia
Volume :
29
Issue :
5
fYear :
2014
fDate :
41760
Firstpage :
2574
Lastpage :
2583
Abstract :
Silicon carbide (SiC) semiconductors are becoming the preferable choice over silicon (Si) semiconductors for power converter applications within the 200 V to 1.2 kV range due to their superior performances. Indirect matrix converters (IMCs) have more potential than traditional back-to-back power converters (BBCs) for achieving higher power densities and longer equipment lifetimes. This paper combines normally off SiC JFETs and the IMC topology to develop a module-based IMC system whose power stage consists of a bidirectional rectifier power module (BPM) and an inverter power module. This combination achieves a power density of approximately 72 kVA/L at the module level. A 5-kVA IMC prototype operating at a switching frequency of 30 kHz and connected to an RL load demonstrates the functionality of the proposed modular IMC system.
Keywords :
invertors; junction gate field effect transistors; matrix convertors; power semiconductor devices; rectifiers; silicon compounds; wide band gap semiconductors; IMC topology; JFET; SiC; back to back power converters; bidirectional rectifier power module; frequency 30 kHz; higher power densities; inverter power module; longer equipment lifetimes; modular indirect matrix converter system; module based IMC system; power converter applications; power stage; voltage 200 V to 1.2 kV; Inverters; JFETs; Logic gates; Matrix converters; Silicon carbide; Switches; Voltage control; Indirect matrix converter (IMC); parasitic inductance; silicon carbide (SiC) JFET;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2013.2290542
Filename :
6670802
Link To Document :
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