DocumentCode
1765527
Title
Device Delay in GaN Transistors Under High Drain Bias Conditions
Author
Dong Seup Lee ; Laboutin, O. ; Yu Cao ; Johnson, Jerry Wayne ; Beam, Edward ; Ketterson, Andrew ; Schuette, M.L. ; Saunier, Paul ; Palacios, T.
Author_Institution
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume
34
Issue
7
fYear
2013
fDate
41456
Firstpage
849
Lastpage
851
Abstract
This letter studies the drain delay caused by the extension of the effective gate length in high-frequency GaN high electron mobility transistors. It is shown that the drain delay is mainly reflected in the gate-to-source capacitance (Cgs) of the device. The ratio of Cgs and transconductance (gm) is then used to accurately extract the drain delay and the result is compared with other extraction methods reported in the literature. Finally, we will use this new extraction technique to explain why short channel GaN devices show higher drain delay than longer channel transistors.
Keywords
III-V semiconductors; capacitance; gallium compounds; high electron mobility transistors; transistors; wide band gap semiconductors; drain delay; effective gate length; extraction methods; gate-to-source capacitance; high drain bias conditions; high electron mobility transistors; longer channel transistors; transconductance; Drain delay; GaN; gate extension; gate-to-source capacitance $(C_{rm gs})$ ; high electron mobility transistor (HEMT); short channel devices; transconductance $(g_{m})$ ;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2013.2262034
Filename
6530699
Link To Document