• DocumentCode
    1765527
  • Title

    Device Delay in GaN Transistors Under High Drain Bias Conditions

  • Author

    Dong Seup Lee ; Laboutin, O. ; Yu Cao ; Johnson, Jerry Wayne ; Beam, Edward ; Ketterson, Andrew ; Schuette, M.L. ; Saunier, Paul ; Palacios, T.

  • Author_Institution
    Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • Volume
    34
  • Issue
    7
  • fYear
    2013
  • fDate
    41456
  • Firstpage
    849
  • Lastpage
    851
  • Abstract
    This letter studies the drain delay caused by the extension of the effective gate length in high-frequency GaN high electron mobility transistors. It is shown that the drain delay is mainly reflected in the gate-to-source capacitance (Cgs) of the device. The ratio of Cgs and transconductance (gm) is then used to accurately extract the drain delay and the result is compared with other extraction methods reported in the literature. Finally, we will use this new extraction technique to explain why short channel GaN devices show higher drain delay than longer channel transistors.
  • Keywords
    III-V semiconductors; capacitance; gallium compounds; high electron mobility transistors; transistors; wide band gap semiconductors; drain delay; effective gate length; extraction methods; gate-to-source capacitance; high drain bias conditions; high electron mobility transistors; longer channel transistors; transconductance; Drain delay; GaN; gate extension; gate-to-source capacitance $(C_{rm gs})$; high electron mobility transistor (HEMT); short channel devices; transconductance $(g_{m})$;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2262034
  • Filename
    6530699