• DocumentCode
    1765945
  • Title

    Dispersion Analysis and Design of Planar Electromagnetic Bandgap Ground Plane for Broadband Common-Mode Suppression

  • Author

    Choi, Jun H. ; Hon, Philip W. C. ; Itoh, Takayuki

  • Author_Institution
    Electr. Eng. Dept., Univ. of California at Los Angeles, Los Angeles, CA, USA
  • Volume
    24
  • Issue
    11
  • fYear
    2014
  • fDate
    Nov. 2014
  • Firstpage
    772
  • Lastpage
    774
  • Abstract
    A planar electromagnetic bandgap (EBG) structure designed for broadband common-mode suppression is proposed. A uniplanar compact photonic-bandgap (UC-PBG) structure with periodic center slots is etched on the ground plane to obtain broadband common mode suppression while minimally disturbing the differential signal within the designed bandwidth. Dispersion analysis has been conducted for both common (even) and differential (odd) mode signals. Good signal integrity is observed in both simulated and measured results. The fractional bandwidth of the proposed EBG ground plane is around 70% with common-mode suppression below -20 dB. The proposed EBG ground planes may be applicable for systems requiring low-cost and simple solutions in designing high-speed differential interlinks operating above 5 Gbps.
  • Keywords
    dispersion (wave); electromagnetic interference; energy gap; etching; interference suppression; photonic band gap; transmission lines; EBG ground plane; broadband common-mode suppression; common mode signals; differential mode signals; dispersion analysis; high-speed differential interlinks; low crosstalk; low electromagnetic interference; periodic center slots; planar electromagnetic bandgap ground plane design; signal integrity; uniplanar compact photonic-bandgap structure; Broadband communication; Dispersion; Microstrip; Periodic structures; Photonic band gap; Transmission lines; Common-mode suppressor; differential transmission lines; dispersion engineering; electromagnetic bandgap (EBG);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2014.2303166
  • Filename
    6740093