• DocumentCode
    1766256
  • Title

    Ultra-dense and ultra-low power microhotplates using silica aerogel

  • Author

    Seyedjalali, Mohammad ; Kumar, Sudhakar ; Madani, M.R.

  • Author_Institution
    Center for Adv. Comput. Studies, Univ. of Louisiana at Lafayette, West Lafayette, LA, USA
  • Volume
    49
  • Issue
    18
  • fYear
    2013
  • fDate
    August 29 2013
  • Firstpage
    1168
  • Lastpage
    1170
  • Abstract
    A thin film of silica aerogel has been spin coated on silicon wafers to investigate its super thermal insulating capability. The temperature of the thin film heaters fabricated on the aerogel coated wafer is measured at different applied powers. Simulations are performed to compare the aerogel coated wafers with the micromachined wafers. Both experimental and simulation results show better heat insulation for aerogel coated wafers as compared with simulated micromachined wafers. The measurement and simulation results of aerogel coated wafers are in good agreement. The aerogel film can replace the air cavity created by conventional micromachining of wafers to save power and chip area in metal oxide gas sensor arrays.
  • Keywords
    aerogels; coating techniques; gas sensors; micromachining; microsensors; sensor arrays; silicon compounds; temperature measurement; temperature sensors; thermal insulation; thin film sensors; SiO2; aerogel film; air cavity; heat insulation; metal oxide gas sensor array; microhotplate; micromachined wafer; silica aerogel coated wafer; spin coating; super thermal insulating capability; temperature measurement; thin film heater fabrication;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2013.1389
  • Filename
    6587661