Title :
Soft Error Hardened Memory Design for Nanoscale Complementary Metal Oxide Semiconductor Technology
Author :
Jing Guo ; Liyi Xiao ; Tianqi Wang ; Shanshan Liu ; Xu Wang ; Zhigang Mao
Author_Institution :
Microelectron. Center, Harbin Inst. of Technol., Harbin, China
Abstract :
Radiation-induced single event upsets (SEUs), or soft errors, have become a dominant factor in the reliability degradation of nanoscale memories. In this paper, based on the SEU physics mechanism, and reasonable layout-topology, a novel soft error hardened memory cell is proposed in 65 nm Complementary Metal Oxide Semiconductor (CMOS) technology. The design comparisons for several hardened memory cells in terms of access time (read access time and write access time), power consumption, and layout area are also executed. The main advantage of the proposed cell is that it can provide 100% fault tolerance, which is very useful for memory applications in severe radiation environments. Furthermore, Monte Carlo simulations are carried out to evaluate the effects of process, voltage, and temperature (PVT) variations. From simulations, we confirmed that the proposed cell has exhibited a sufficient multiple-node upset tolerance capability even under PVT variations.
Keywords :
CMOS memory circuits; Monte Carlo methods; integrated circuit design; integrated circuit reliability; radiation hardening (electronics); CMOS technology; Monte Carlo simulations; PVT variations; SEU physics mechanism; complementary metal oxide semiconductor technology; layout area; layout-topology; nanoscale memories; power consumption; process voltage and temperature variations; radiation-induced single event upsets; read access time; reliability degradation; size 65 nm; soft error hardened memory cell; write access time; CMOS integrated circuits; Computer architecture; Layout; Metals; Microprocessors; Radiation hardening (electronics); Transistors; Single event upset; memory; multiple-node upset; radiation hardened;
Journal_Title :
Reliability, IEEE Transactions on
DOI :
10.1109/TR.2015.2410275