Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate

Author

Dinh, Thanh Vinh ; Pagazani, Julien ; Lesenechal, Dominique ; Pasquet, Daniel ; Descamps, Philippe ; Lissorgues, Gaelle ; Nicole, Pierre

Author_Institution

Lab. of Microelectron. & Phys. of Semicond., Caen, France

Volume

5

Issue

1

fYear

2015

fDate

Jan. 2015

Firstpage

119

Lastpage

127

Abstract

The dependence of self-inductance and mutual inductance on bonding wire (BW) geometric profile has been studied in several papers. This paper will present a method using a BW-geometric-profile-dependent term to include this dependence in a simple model of BWs. The model element values will be calculated only from geometric dimensions. An experimental structure of two BWs in parallel planes has been fabricated based upon glass substrate technique for verification. A good agreement was obtained up to 8 GHz in comparison to electromagnetic simulation and measurement.

Keywords

bonding processes; chip scale packaging; glass; inductance; wires (electric); bonding-wire-geometric-profile-dependent model; glass substrate; model element values; mutual coupling; mutual inductance; parallel planes; self-inductance; Bonding; Glass; Inductance; Integrated circuit modeling; Substrates; Wires; Bonding wire (BW); electromagnetic (EM) modeling; glass; inductance formula; mutual coupling; mutual coupling.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2366730

Filename

6994249