Title :
Bonding-Wire-Geometric-Profile-Dependent Model for Mutual Coupling Between Two Bonding Wires on a Glass Substrate
Author :
Dinh, Thanh Vinh ; Pagazani, Julien ; Lesenechal, Dominique ; Pasquet, Daniel ; Descamps, Philippe ; Lissorgues, Gaelle ; Nicole, Pierre
Author_Institution :
Lab. of Microelectron. & Phys. of Semicond., Caen, France
Abstract :
The dependence of self-inductance and mutual inductance on bonding wire (BW) geometric profile has been studied in several papers. This paper will present a method using a BW-geometric-profile-dependent term to include this dependence in a simple model of BWs. The model element values will be calculated only from geometric dimensions. An experimental structure of two BWs in parallel planes has been fabricated based upon glass substrate technique for verification. A good agreement was obtained up to 8 GHz in comparison to electromagnetic simulation and measurement.
Keywords :
bonding processes; chip scale packaging; glass; inductance; wires (electric); bonding-wire-geometric-profile-dependent model; glass substrate; model element values; mutual coupling; mutual inductance; parallel planes; self-inductance; Bonding; Glass; Inductance; Integrated circuit modeling; Substrates; Wires; Bonding wire (BW); electromagnetic (EM) modeling; glass; inductance formula; mutual coupling; mutual coupling.;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2366730
