DocumentCode :
1766422
Title :
Single Event Effect Analysis on DC and RF Operated AlGaN/GaN HEMTs
Author :
Rostewitz, M. ; Hirche, K. ; Latti, J. ; Jutzi, E.
Author_Institution :
Tesat-Spacecom GmbH & Co. KG, Backnang, Germany
Volume :
60
Issue :
4
fYear :
2013
fDate :
Aug. 2013
Firstpage :
2525
Lastpage :
2529
Abstract :
Heavy ion irradiation testing was performed on AlGaN/GaN High Electron Mobility Transistors (HEMTs), both under DC and RF operation. Single gate finger radiation test structures and multiple gate finger RF power cells were tested and failure mechanisms analyzed. Chip level peak voltage measurements on L-band power AlGaN/GaN HEMTs are compared to Single Event Burn-out voltage levels extracted from DC Single Event Effect (SEE) test results.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; ion beam effects; semiconductor device testing; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN high electron mobility transistors; DC operated AlGaN-GaN HEMT; DC operation; DC single event effect; L-band power AlGaN-GaN HEMT; RF operated AlGaN-GaN HEMT; RF operation; chip level peak voltage measurements; failure mechanisms; heavy ion irradiation testing; multiple gate finger RF power cells; single event burn-out voltage levels; single event effect analysis; single gate finger radiation test structures; Gallium nitride; HEMTs; Logic gates; MODFETs; Radiation effects; Radio frequency; Voltage measurement; AlGaN/GaN HEMT; heavy ion irradiation; single event effect; space radiation;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2013.2247774
Filename :
6484212
Link To Document :
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