DocumentCode :
1766462
Title :
Understanding electrical discharge endurance of epoxy micro- and nano-composites through thermal analysis
Author :
Iyer, Gopalakrishnan ; Gorur, R. ; Krivda, A.
Author_Institution :
Sch. of Electr., Energy & Comput. Eng., Arizona State Univ., Tempe, AZ, USA
Volume :
21
Issue :
1
fYear :
2014
fDate :
41671
Firstpage :
225
Lastpage :
229
Abstract :
Thermal analysis of epoxy solid dielectrics containing micron sized, nanometer sized, and a mixture of the two sizes, of silica was performed. Measurements of thermal conductivity and thermo gravimetric analysis (TGA) were conducted. The TGA data showed higher weight loss initiation temperatures for samples containing up to 5% by weight of nanofillers as compared to the same material with much higher levels of conventional microfillers and unfilled sample, and this was in good correlation with the erosion damage due to corona. Average thermal conductivity measurements yielded results that was fairly well correlated with the rule of mixtures calculation, therefore could not explain the higher electrical discharge resistance or TGA data of nanofilled materials. Much research is needed to understand and exploit the advantages of nanocomposites and some ideas are presented.
Keywords :
corona; discharges (electric); nanocomposites; thermal analysis; thermal conductivity measurement; TGA data; corona; electrical discharge endurance; electrical discharge resistance; epoxy microcomposites; epoxy solid dielectrics; microfillers; mixtures calculation; nanocomposites; nanofilled materials; thermal analysis; thermal conductivity measurements; thermogravimetric analysis; Conductivity; Conductivity measurement; Corona; Discharges (electric); Temperature measurement; Thermal conductivity; Epoxy nanocomposites; corona resistance; erosion depth; microcomposites; nanodielectrics; nanofillers;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2013.003466
Filename :
6740744
Link To Document :
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