• DocumentCode
    1766462
  • Title

    Understanding electrical discharge endurance of epoxy micro- and nano-composites through thermal analysis

  • Author

    Iyer, Gopalakrishnan ; Gorur, R. ; Krivda, A.

  • Author_Institution
    Sch. of Electr., Energy & Comput. Eng., Arizona State Univ., Tempe, AZ, USA
  • Volume
    21
  • Issue
    1
  • fYear
    2014
  • fDate
    41671
  • Firstpage
    225
  • Lastpage
    229
  • Abstract
    Thermal analysis of epoxy solid dielectrics containing micron sized, nanometer sized, and a mixture of the two sizes, of silica was performed. Measurements of thermal conductivity and thermo gravimetric analysis (TGA) were conducted. The TGA data showed higher weight loss initiation temperatures for samples containing up to 5% by weight of nanofillers as compared to the same material with much higher levels of conventional microfillers and unfilled sample, and this was in good correlation with the erosion damage due to corona. Average thermal conductivity measurements yielded results that was fairly well correlated with the rule of mixtures calculation, therefore could not explain the higher electrical discharge resistance or TGA data of nanofilled materials. Much research is needed to understand and exploit the advantages of nanocomposites and some ideas are presented.
  • Keywords
    corona; discharges (electric); nanocomposites; thermal analysis; thermal conductivity measurement; TGA data; corona; electrical discharge endurance; electrical discharge resistance; epoxy microcomposites; epoxy solid dielectrics; microfillers; mixtures calculation; nanocomposites; nanofilled materials; thermal analysis; thermal conductivity measurements; thermogravimetric analysis; Conductivity; Conductivity measurement; Corona; Discharges (electric); Temperature measurement; Thermal conductivity; Epoxy nanocomposites; corona resistance; erosion depth; microcomposites; nanodielectrics; nanofillers;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2013.003466
  • Filename
    6740744