Compact Self-Packaged Dual-Band Filter Using Multilayer Liquid Crystal Polymer Technology

Author

Cervera, Francisco J. ; Jiasheng Hong

Author_Institution

Dept. of Electr., Electron. & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK

Volume

62

Issue

11

fYear

2014

fDate

Nov. 2014

Firstpage

2618

Lastpage

2625

Abstract

A compact self-packaged dual-band filter structure using multilayer liquid crystal polymer technology is presented in this paper. The frequency and bandwidth of each passband can be more conveniently controlled by means of vertically embedded elements, i.e., metal patches, placed above the coupled folded multi-stepped impedance resonators. The packaged solution is connected to the outer environment through a coplanar waveguide that allows flip-chip interconnection to a host board. The proposed design is validated with the fabrication of two prototypes. The measured results show good agreement with the simulations.

Keywords

coplanar waveguides; flip-chip devices; integrated circuit interconnections; liquid crystal polymers; resonator filters; compact self-packaged dual-band filter; coplanar waveguide; coupled folded multistepped impedance resonators; flip-chip interconnection; metal patches; multilayer liquid crystal polymer technology; vertically embedded elements; Couplings; Dual band; Impedance; Magnetic resonance; Magnetic separation; Passband; Dual-band filters; liquid crystal polymer (LCP); microwave filters; self-packaged filters;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2014.2359635

Filename

6919351