Title :
Self-adaptive partial discharge signal de-noising based on ensemble empirical mode decomposition and automatic morphological thresholding
Author :
Chan, Jeffery C. ; Hui Ma ; Saha, Tapan K. ; Ekanayake, Chandima
Author_Institution :
Sch. of Inf. Technol. & Electr. Eng., Univ. of Queensland, St. Lucia, QLD, Australia
Abstract :
This paper proposes a self-adaptive technique for partial discharge (PD) signal denoising with automatic threshold determination based on ensemble empirical mode decomposition (EEMD) and mathematical morphology. By introducing extra noise in the decomposition process, EEMD can effectively separate the original signal into different intrinsic mode functions (IMFs) with distinctive frequency scales. Through the kurtosis-based selection criterion, the IMFs embedded with PD impulses can be extracted for reconstruction. On the basis of mathematical morphology, an automatic morphological thresholding (AMT) technique is developed to form upper and lower thresholds for automatically eliminating the residual noise while maintaining the PD signals. The results on both simulated and real PD signals show that the above PD denoising technique is superior to wavelet transform (WT) and conventional EMD-based PD de-noising techniques.
Keywords :
mathematical morphology; partial discharges; signal denoising; wavelet transforms; AMT technique; EEMD; IMF; PD impulses; WT; automatic morphological thresholding technique; automatic threshold determination; distinctive frequency scales; ensemble empirical mode decomposition; intrinsic mode functions; lower thresholds; mathematical morphology; residual noise elimination; self-adaptive partial discharge signal denoising; upper thresholds; wavelet transform; Discrete wavelet transforms; Morphology; Noise reduction; Partial discharges; Signal denoising; White noise; De-noising; ensemble empirical mode decomposition (EEMD); highvoltage (HV) equipment; mathematical morphology; partial discharge (PD); wavelettransform (WT);
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2013.003839