DocumentCode
1766753
Title
Ultra-thin spoof surface plasmonic structure and its application to bandpass filter design
Author
Xiaoyong Liu ; Junming Zhao ; Tian Jiang ; Yijun Feng
Author_Institution
Dept. of Electron. EngineeJunmingring, Nanjing Univ., Nanjing, China
fYear
2014
fDate
24-26 March 2014
Firstpage
1
Lastpage
4
Abstract
In this paper, the dispersions and electromagnetic wave transmission of higher-order modes in a kind of ultra-thin spoof surface plasmonic structures, the conformal surface plasmon (CSP) structure, have been explored at microwave frequency. The transmission spectrum shows a multi-passband characteristic. To eliminate the radiation loss associated with the higher-order modes, a ground plane is introduced to the CSP structure, and it is found that the dispersion curves and transmission spectrum exhibit the similar feature as that of the CSP structure without ground, but with much less radiation loss. The multiband transmission characteristic of the CSP structure has also been applied to design bandpass filter (BPF). It is found that by combining CSP structures with different groove depth the passband of the BPF could be tuned. The designed BPFs have been validated with both the full-wave simulations and the measurements on fabricated prototype at microwave frequency.
Keywords
band-pass filters; dispersion (wave); electromagnetic wave transmission; plasmonics; CSP structure; bandpass filter; conformal surface plasmon structure; dispersion curves; electromagnetic wave transmission; full-wave simulations; ground plane; higher-order modes; microwave frequency; multiband transmission characteristic; multipassband characteristic; transmission spectrum; ultra-thin spoof surface plasmonic structure; Band-pass filters; Corrugated surfaces; Microwave frequencies; Passband; Plasmons; Strips; Surface waves; bandpass filter; higher-order mode; spoof surface plasmonic wave;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Symposium (IWS), 2014 IEEE International
Conference_Location
X´ian
Type
conf
DOI
10.1109/IEEE-IWS.2014.6864241
Filename
6864241
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