Ceramic based novel multilayer and miniaturized RF/millimetre-wave components and highly integrated mm-wave modules

This paper describes the realization of novel multilayer miniaturized and high performance passive components, covering a wide frequency range (RF to millimeter-wave), and a highly compact millimeter-wave subsystems at a low cost using advanced multilayer ceramic based photoimageable thick film technology. The multilayer miniaturized passive components have been designed using meander-line and lumped-distributed approach, and characterized covering IF (2GHz) as well as RF (> 80 GHz) frequencies for a complete system. At the same time compact and high-Q multilayer lumped components have been designed and modeled up to mmW frequency with excellent performance. Lumped element filters have remarkably low pass band loss with high stop band attenuation and miniaturization. These performances are better than most of the reported results from conventional multichip module (MCM) technologies. Further, using a new integration technique, where IC mounting cavities are formed from trench-vias and have precise dimensional control, a mmW modules are realized onto a single substrate integrating MMICs with RF (V-band) SIW components and embedded lumped element (IF) low-pass filter and other passives in bias network with high performance and compactness.