Title :
Comparison of filters: Inkjet printed on PEN substrate versus a laser-etched on LCP substrate
Author :
Arabi, Eyad ; Mckerricher, Garret ; Shamim, Atif
Author_Institution :
Dept. of Comput., King Abdullah Univ. of Sci. & Technol., Thuwal, Saudi Arabia
Abstract :
In this paper, microstrip-based bandpass filters on polyethylene naphthalate (PEN) and liquid crystal polymers (LCP) are presented to investigate the performance of filters on ultra-thin substrates. PEN (with a thickness of 120 μm) has been characterized and used for a filter for the first time. In addition to being low cost and transparent, it demonstrates comparable RF performance to LCP. The conductor losses are compared by fabricating filters with inkjet printed lines as well as laser etched copper clad LCP sheets. With 5 layers of inkjet printing, and a curing temperature below 200°C, a final silver thickness of 2 μm and conductivity of 9.6 × 106 S/m are achieved. The designs are investigated at two frequencies, 24 GHz as well as 5 GHz to assess their performance at high and low frequencies respectively. The 24 GHz inkjet printed filter shows an insertion loss of 2 dB, while the 5 GHz design gives an insertion loss of 8 dB. We find that thin substrates have a strong effect on the insertion loss of filters especially as the frequency is reduced. The same design, realized on LCP (thickness of 100 μm) through laser etching, demonstrates a very similar performance, thus verifying this finding.
Keywords :
band-pass filters; copper; curing; ink jet printing; liquid crystal polymers; microstrip filters; microwave filters; silver; Ag; Cu; LCP sheets; LCP substrate; PEN substrate; conductor loss; curing temperature; frequency 24 GHz; frequency 5 GHz; inkjet printed lines; laser etched copper clad; liquid crystal polymers; loss 2 dB; loss 8 dB; microstrip-based bandpass filters; polyethylene naphthalate; silver thickness; size 100 mum; size 120 mum; size 2 mum; ultrathin substrates; Conductivity; Ink; Insertion loss; Microwave filters; Printing; Silver; Substrates;
Conference_Titel :
Microwave Conference (EuMC), 2014 44th European
Conference_Location :
Rome
DOI :
10.1109/EuMC.2014.6986663