• DocumentCode
    1767074
  • Title

    Compact 10 ∼ 13 GHz GaN low noise amplifier MMIC using simple matching and bias circuits

  • Author

    Woojin Chang ; Young-Rak Park ; Jae-Kyoung Mun ; Sang-Choon Ko ; Gye-Ik Jeon

  • Author_Institution
    GaN Power Electron. Res. Sect., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • fYear
    2014
  • fDate
    6-9 Oct. 2014
  • Firstpage
    1460
  • Lastpage
    1463
  • Abstract
    A compact 10 ~ 13 GHz low-noise amplifier (LNA) monolithic microwave integrated circuit (MMIC) using simple matching and bias circuits is designed and fabricated using AlGaN/GaN 0.25 μm high electron mobility transistor (HEMT) technology on silicon carbide (SiC) substrate. In order to reduce the chip size and simplify the structure of the LNA, the matching and bias circuits were combined functionally and structurally together and the meandered microstriplines were used. And the combined circuits also contributed to decrease the noise figure of the LNA. Therefore, the measured noise figures of the LNA are almost equal to the minimum noise figure of 2 × 100 μm device which was used for the first stage of the LNA. And also the chip size of the fabricated LNA is 1.7 × 0.8 mm2 including two ground-signal-ground (GSG) pads and the DC pads on the chip. The LNA shows a noise figure of 1.7 ~ 2.1 dB with a gain of 19 ~ 26 dB across the 10 ~ 13 GHz frequency range. In continuous wave (CW) conditions, it presents a saturated output power of 29 ~ 34 dBm for 10 ~ 13 GHz and also the output third-order intercept point (OIP3) of 42 dBm at 11.4 GHz.
  • Keywords
    III-V semiconductors; MMIC amplifiers; aluminium compounds; gallium compounds; high electron mobility transistors; low noise amplifiers; microstrip lines; silicon compounds; wide band gap semiconductors; AlGaN-GaN; CW conditions; DC pads; GSG pads; HEMT technology; LNA MMIC; SiC; SiC substrate; chip size; continuous wave conditions; frequency 10 GHz to 13 GHz; ground-signal-ground pads; high electron mobility transistor technology; low-noise amplifier monolithic microwave integrated circuit; microstrip lines; noise figure; silicon carbide substrate; simple matching and bias circuits; size 0.25 mum; Gallium nitride; HEMTs; MMICs; Microwave amplifiers; Microwave circuits; Noise figure; GaN; LNA; chip size reduction; matching circuit;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2014 44th European
  • Conference_Location
    Rome
  • Type

    conf

  • DOI
    10.1109/EuMC.2014.6986723
  • Filename
    6986723