• DocumentCode
    1767096
  • Title

    Design of a near-field-focused substrate integrated planar array antenna

  • Author

    Lei Wang ; Yu Jian Cheng ; Fei Xue

  • Author_Institution
    Sch. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2014
  • fDate
    6-9 Oct. 2014
  • Firstpage
    1512
  • Lastpage
    1515
  • Abstract
    A X-band multi-layer near-field-focused antenna (NFFA) is developed on the basis of substrate integrated waveguide (SIW) technology and fabricated through PCB process. Several metallic vias with different diameters, which are equivalent to open-ended air-filled circular waveguides, are fabricated to form phase shifters and radiating elements at the same time. They are fed by an SIW wideband feeding network underneath these radiating elements to achieve a compact configuration. Between the radiating and feeding layers, there exists a separated matching layer to achieve a good reflection characteristic. As an example, a 4×4 NFFA prototype is fabricated and measure. The maximum intensity of the electric field is at 150 mm. The measured results are in good agreement with the simulated ones near the focal distance.
  • Keywords
    antenna feeds; broadband antennas; circular waveguides; microwave antennas; planar antenna arrays; substrate integrated waveguides; waveguide antenna arrays; NFFA; PCB process; SIW technology; SIW wideband feeding network; X-band multi-layer near-field-focused antenna; electric field; feeding layers; focal distance; near-field-focused substrate integrated planar array antenna; open-ended air-filled circular waveguides; reflection characteristic; substrate integrated wave-guide technology; Antenna measurements; Aperture antennas; Microstrip antenna arrays; Substrates; multi-layer technology; near-field-focused antenna; substrate integrated waveguide (SIW);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2014 44th European
  • Conference_Location
    Rome
  • Type

    conf

  • DOI
    10.1109/EuMC.2014.6986736
  • Filename
    6986736