A 6–18 GHz GaAs multifunctional chip for transmit/receive modules

Author

Bentini, Andrea ; Ferrari, Mauro ; Longhi, Patrick E. ; Marzolf, Eric ; Moron, Joel ; Leblanc, Remy

Author_Institution

Hardware Dev. - Microwaves & Antennas, Elettron. S.p.A., Rome, Italy

fYear

2014

fDate

6-9 Oct. 2014

Firstpage

1908

Lastpage

1911

Abstract

In this contribution the development, design, fabrication and test of a highly integrated broadband multifunctional chip is presented. The MMIC covers the C-, X- and Ku-Band and it is suitable for applications in high performance Transmit/Receive Modules. In less than 26 mm², the MMIC embeds several T/R switches, low noise/medium power amplifiers, a stepped phase shifter and analog/digital attenuators in order to perform the RF signal routing and phase/amplitude conditioning. Besides, an embedded serial-to-parallel converter drives the phase shifter and the digital attenuator leading to a reduction in complexity of the digital control interface.

Keywords

III-V semiconductors; MMIC power amplifiers; attenuators; gallium arsenide; low noise amplifiers; microwave phase shifters; microwave switches; C-band; GaAs; GaAs multifunctional chip; Ku-band; MMIC; RF signal routing; T-R switches; X-band; analog-digital attenuators; digital control interface; frequency 6 GHz to 18 GHz; integrated broadband multifunctional chip; low noise amplifiers; medium power amplifiers; phase-amplitude conditioning; serial-to-parallel converter; stepped phase shifter; transmit-receive modules; Attenuators; Gain; Gallium arsenide; MMICs; Microwave amplifiers; Microwave circuits; Broadband MMIC; Core-Chip; Mixed-Signal; Phased Array; Transmit/Receive Module;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2014 44th European

Conference_Location

Rome

Type

conf

DOI

10.1109/EuMC.2014.6986835

Filename

6986835