DocumentCode :
1767651
Title :
A study of using nonnegative matrix factorization to detect solder-voids from radiographic images of solder
Author :
Mouri, M. ; Kato, Yu ; Yasukawa, Hiroshi ; Takumi, Ichi
Author_Institution :
Fac. of Bus. Adm., Aichi Univ., Toyohashi, Japan
fYear :
2014
fDate :
1-4 June 2014
Firstpage :
1074
Lastpage :
1079
Abstract :
Accurate detection of voids in solder bumps on ball grid arrays (BGAs) is important for improving device quality. Radiographic imaging is commonly used to inspect BGA packages incorporate into LSI circuits. In the case of conventional method, imaging is normally done four times, and the images obtained are averaged to reduce noises. We have developed a nonnegative matrix factorization method for detecting solder-voids using only three radiographic images. Computer simulation demonstrated that it has the same level of accuracy as the conventional method.
Keywords :
ball grid arrays; large scale integration; matrix decomposition; radiography; solders; voids (solid); BGA packages; LSI circuits; ball grid arrays; computer simulation; nonnegative matrix factorization method; radiographic imaging; radiographic solder images; solder bumps; solder-void detection; Computers; Indexes; Noise; Thermal noise; Training; X-ray detectors; X-ray imaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics (ISIE), 2014 IEEE 23rd International Symposium on
Conference_Location :
Istanbul
Type :
conf
DOI :
10.1109/ISIE.2014.6864763
Filename :
6864763
Link To Document :
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