• DocumentCode
    1767969
  • Title

    Reliability assesment in the design of interleaved converters under multi-physical constraints

  • Author

    Bendali, Mahraz ; Larouci, C. ; Azib, Toufik ; Marchand, Claude ; Coquery, G.

  • Author_Institution
    CERIE, ESTACA Eng. Sch., Levallois-Perret, France
  • fYear
    2014
  • fDate
    1-4 June 2014
  • Firstpage
    2117
  • Lastpage
    2121
  • Abstract
    This paper presents the integration of the reliability assessment in a pre-design approach of interleaved converters for embedded automotive applications. This approach is based on a multi-physic optimization to pre-size the entire converter and its components. The design constraints are progressively integrated, in addition the reliability aspect of power components is considered in the early steps of the design. The proposed method is applied to an Interleaved Buck Converter IBC. It allows to pre-size converter determining the optimal number of cells under multi-physics constraints such as electric, efficiency, thermal, volume and in particularly the reliability, which is considered in same level of pre-design to eliminate all risk of feasibility. This paper describes the reliability assessment approach of the converter using the FIDES methodology for components reliability. Therefore, this approach takes account of mission profile associated with operating conditions to assess the lifetime of power converter.
  • Keywords
    DC-DC power convertors; automotive components; embedded systems; optimisation; reliability; FIDES methodology; IBC; component reliability; embedded automotive applications; interleaved buck converter; mission profile; multiphysical constraints; multiphysics constraints; multiphysics optimization; power components; power converter; reliability assessment approach; Catalogs; Computer architecture; Humidity; Inductance; Industries; Reliability engineering; FIDES Reliability; Interleaved buck converter; Optimization algorithm; design methodology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics (ISIE), 2014 IEEE 23rd International Symposium on
  • Conference_Location
    Istanbul
  • Type

    conf

  • DOI
    10.1109/ISIE.2014.6864944
  • Filename
    6864944