• DocumentCode
    176804
  • Title

    Simulation based correlation analysis on performance issues of semiconductor wafer fabrication facilities

  • Author

    Xingwei Pan ; Li Li ; Zhongbo Chen ; Pengde Jia

  • Author_Institution
    Coll. of Electron. & Inf. Eng., Tongji Univ., Shanghai, China
  • fYear
    2014
  • fDate
    May 31 2014-June 2 2014
  • Firstpage
    4019
  • Lastpage
    4024
  • Abstract
    There are many performance issues concerned in a semiconductor wafer fabrication facility (fab), such as move, queue length, utility, cycle time, throughput and on-time delivery rate. However, it is difficult to demonstrate their relations to each other. In this paper, the correlation coefficient method is utilized to analyze their relations from plentiful simulation results and obtain some meaningful conclusions. Firstly, these performance issues are classified into three categories, i.e., machine related, fab-wide related and job related ones. Secondly, a mass of simulation data related to performance issues are obtained with a variety of simulations with different workload levels (under-loading, heavy-loading and over-loading) and decision criterions (FIFO, EDD, SPT, LS and CR). Thirdly, correlation coefficient method is used to identify the correlations among these performance issues from simulation data. Finally, we obtain a performance system of fabs.
  • Keywords
    production facilities; semiconductor industry; CR; EDD; FIFO; LS; SPT; correlation analysis; correlation coefficient method; semiconductor wafer fabrication; Analytical models; Correlation; Correlation coefficient; Data models; Dry etching; Throughput; Workstations; Correlation Coefficient Analysis; Performance; Semiconductor Manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control and Decision Conference (2014 CCDC), The 26th Chinese
  • Conference_Location
    Changsha
  • Print_ISBN
    978-1-4799-3707-3
  • Type

    conf

  • DOI
    10.1109/CCDC.2014.6852884
  • Filename
    6852884