DocumentCode
176804
Title
Simulation based correlation analysis on performance issues of semiconductor wafer fabrication facilities
Author
Xingwei Pan ; Li Li ; Zhongbo Chen ; Pengde Jia
Author_Institution
Coll. of Electron. & Inf. Eng., Tongji Univ., Shanghai, China
fYear
2014
fDate
May 31 2014-June 2 2014
Firstpage
4019
Lastpage
4024
Abstract
There are many performance issues concerned in a semiconductor wafer fabrication facility (fab), such as move, queue length, utility, cycle time, throughput and on-time delivery rate. However, it is difficult to demonstrate their relations to each other. In this paper, the correlation coefficient method is utilized to analyze their relations from plentiful simulation results and obtain some meaningful conclusions. Firstly, these performance issues are classified into three categories, i.e., machine related, fab-wide related and job related ones. Secondly, a mass of simulation data related to performance issues are obtained with a variety of simulations with different workload levels (under-loading, heavy-loading and over-loading) and decision criterions (FIFO, EDD, SPT, LS and CR). Thirdly, correlation coefficient method is used to identify the correlations among these performance issues from simulation data. Finally, we obtain a performance system of fabs.
Keywords
production facilities; semiconductor industry; CR; EDD; FIFO; LS; SPT; correlation analysis; correlation coefficient method; semiconductor wafer fabrication; Analytical models; Correlation; Correlation coefficient; Data models; Dry etching; Throughput; Workstations; Correlation Coefficient Analysis; Performance; Semiconductor Manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Control and Decision Conference (2014 CCDC), The 26th Chinese
Conference_Location
Changsha
Print_ISBN
978-1-4799-3707-3
Type
conf
DOI
10.1109/CCDC.2014.6852884
Filename
6852884
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