• DocumentCode
    176806
  • Title

    A study on the effect of water vapor condensation on the stratospheric airship ascending process

  • Author

    Zhenzhen Li ; Xiaomin Wang ; Xianwu Lin

  • Author_Institution
    Dept. of Autom., Xiamen Univ., Xiamen, China
  • fYear
    2014
  • fDate
    May 31 2014-June 2 2014
  • Firstpage
    4025
  • Lastpage
    4030
  • Abstract
    A model considering water vapor condensation process is built in this paper to simulate the process of airship ascending more accurately. In order to consider the difference of skin temperature around the airship surface, the skin of airship is divided into small grids. The radiation heat absorbed by the internal gas when the skin is semitransparent is calculated with an improved net heat method. With the assumption that the water vapor density of the airship in the air bag is saturated, the calculation method of the latent heat generated by the vapor condensation process and the attenuation coefficient of the thermal radiation under the corresponding vapor density are analyzed. By uniting the dynamical model, thermal model and ideal gas law, the simulation model for the ascending process is built. Numerical result is proposed for a concept airship. The results show that the condensation process does affect the ascending process and should be considered.
  • Keywords
    airships; condensation; water; H2O; airship surface; attenuation coefficient; dynamical model; ideal gas law; internal gas; latent heat; net heat method; radiation heat; skin temperature; stratospheric airship ascending process; thermal model; thermal radiation; water vapor condensation effect; water vapor density; Atmospheric modeling; Attenuation; Manganese; Skin; Thermodynamics; Water heating; Airship; Numerical Simulation; Phase Transition; Thermal-dynamical Coupling; Vapor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control and Decision Conference (2014 CCDC), The 26th Chinese
  • Conference_Location
    Changsha
  • Print_ISBN
    978-1-4799-3707-3
  • Type

    conf

  • DOI
    10.1109/CCDC.2014.6852885
  • Filename
    6852885