Ground-bounce reduction in narrow-band RF front-ends

Author

Kumar, Ajit ; Aniruddhan, Sankaran

Author_Institution

Dept. of Electr. Eng., Indian Inst. of Technol., Madras, Chennai, India

fYear

2014

fDate

1-5 June 2014

Firstpage

189

Lastpage

192

Abstract

Ground-bounce due to bond wire inductance is a well known problem in Radio-Frequency (RF) Integrated Circuits. In this paper we propose the use of series resonance with an extra bond wire to substantially reduce ground-bounce effects in narrowband RF front-ends. Instability caused by the ground bond wire is also tackled. Impedance balancing of output stage to null ground-bounce due to other on-chip circuitry is discussed. The proposed techniques are applied to the design of a power amplifier (PA) for 2.5GHz applications and detailed simulations are performed to support the same.

Keywords

UHF integrated circuits; UHF power amplifiers; circuit stability; lead bonding; RFIC; bond wire inductance; frequency 2.5 GHz; ground bond wire; ground-bounce effect reduction; ground-bounce reduction; impedance balancing; narrow-band RF front-ends; narrowband RF front-ends; null ground-bounce; on-chip circuitry; power amplifier; radiofrequency integrated circuits; series resonance; Bridge circuits; Impedance; Inductance; Radio frequency; Resonant frequency; System-on-chip; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (ISCAS), 2014 IEEE International Symposium on

Conference_Location

Melbourne VIC

Print_ISBN

978-1-4799-3431-7

Type

conf

DOI

10.1109/ISCAS.2014.6865097

Filename

6865097