DocumentCode :
1768625
Title :
A curvature-compensation technique based on the difference of Si and SiGe junction voltages for bandgap voltage circuits
Author :
Yi Huang ; Li Zhu ; Chun Cheung ; Najafizadeh, Laleh
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
fYear :
2014
fDate :
1-5 June 2014
Firstpage :
914
Lastpage :
917
Abstract :
This paper presents a novel curvature-compensation technique for bandgap reference circuits implemented in Silicon-Germanium (SiGe) BiCMOS technology. The technique utilizes the designer´s access to both Si-based and SiGe-based p-n junctions. Temperature compensation is achieved in two steps: first, by weighted subtraction of two Complementary to Absolute Temperature (CTAT) currents, one proportional to the base-emitter junction of a Si BJT, and the other proportional to that of SiGe HBTs, the non-linear temperature dependent terms are compensated; and second, by adding a Proportional to Absolute Temperature (PTAT) current, the remaining linear temperature dependent terms are canceled. As a result, an almost complete temperature compensation is achieved. Based on this concept, a circuit is designed and simulated in IBM´s SiGe BiCMOS 8HP technology. With a power supply of 2.5 V, simulation results show that the circuit generates an output voltage of 978.5 mV with a temperature coefficient (TC) of 1.0 ppm/°C over the temperature range of -25 °C to 125 °C.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; energy gap; heterojunction bipolar transistors; reference circuits; BJT; BiCMOS technology; HBT; SiGe; bandgap reference circuits; bandgap voltage circuits; base-emitter junction; complementary to absolute temperature currents; curvature-compensation technique; junction voltages; nonlinear temperature; power supply; proportional to absolute temperature current; temperature -25 C to 125 C; temperature compensation; voltage 2.5 V; voltage 978.5 mV; Generators; Junctions;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
Conference_Location :
Melbourne VIC
Print_ISBN :
978-1-4799-3431-7
Type :
conf
DOI :
10.1109/ISCAS.2014.6865285
Filename :
6865285
Link To Document :
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