Title :
A highly integrated biomedical multiprocessor SoC design for a wireless bedside monitoring system
Author :
Kuen-Chih Lin ; Jui-Chieh Liao ; Wai-Chi Fang
Author_Institution :
Dept. of Electron. Eng. & Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
This paper presents a highly integrated multiprocessor system-on-chip (SoC) design, enabling real-time processing of multi-biomedical signals in a wireless bedside monitoring system. This system includes a real-time online recursive independent component analysis (ORICA) processor to automatically remove brain electroencephalogram (EEG) artifacts signals, a heart rate variability (HRV) analysis processor for monitoring electrocardiogram (ECG) signals, and a basic biomedical signal processor for monitoring common physiological data such as oxygen saturation, blood pressure, or body temperature. The multiprocessor chip is fabricated using TSMC 90 nm CMOS technology, and occupies a core area of 1,600 × 1,600 um2. Simulated power consumption is 15.89 mW under the conditions of 1.0V core supply voltage and 64 MHz clock operation frequency.
Keywords :
CMOS integrated circuits; electrocardiography; electroencephalography; independent component analysis; multiprocessing systems; system-on-chip; ECG signals; HRV analysis processor; ORICA processor; TSMC 90 nm CMOS technology; basic biomedical signal processor; brain EEG artifacts signals; brain electroencephalogram artifacts signals; electrocardiogram signals; frequency 64 MHz; heart rate variability analysis processor; highly integrated multiprocessor SoC design; highly integrated multiprocessor system-on-chip design; multibiomedical signals; physiological data monitoring; power 15.89 mW; real-time online recursive independent component analysis processor; real-time processing; size 90 nm; voltage 1.0 V; wireless bedside monitoring system; Biomedical monitoring; Electroencephalography; Engines; Heart rate variability; Monitoring; Wireless communication; Wireless sensor networks;
Conference_Titel :
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
Conference_Location :
Melbourne VIC
Print_ISBN :
978-1-4799-3431-7
DOI :
10.1109/ISCAS.2014.6865404