Study on the reliability enhancement test of MEMS layered structure

The reliability level of MEMS component´s layered structure is low and there isn´t standardized methods to test it. This paper introduces the reliability enhancement test to study the reliability issues of MEMS layered structure. By analyzing common failure modes and causes of MEMS layered structure, the thermal-cycle test is determined as the stress, based on which the test profile is designed. The silicon-glass layered structure is selected as the typical subject for experimental research. The simulation experiments are carried out using ANSYS finite element analysis software. Simulation results suggest that the designed Reliability Enhancement Test (RET) profiles can stimulate latent defects effectively. Thermal-cycle stress can lead to MEMS structure´s fatigue between layers. There exist two main failure modes of MEMS layered structure, namely delamination and deformation. Finally, the delamination failure mechanisms are researched.