DocumentCode
1769078
Title
The application of transient thermal analysis in solder joint thermal fatigue life analysis
Author
Xianglei Kong ; Fengming Lu ; Weili Li
Author_Institution
China Aero Poly-Technol. Establ., Beijing, China
fYear
2014
fDate
24-27 Aug. 2014
Firstpage
71
Lastpage
74
Abstract
In this paper, a method of solder joint thermal fatigue life analysis using transient thermal analysis is introduced, and also a case study of temperature shock test to an CPU module. The results show that this method obtained the temperature load under actual use, which is closer to engineering problems. The module´s maximum temperature variation range is 50D-132D. Under the temperature load, the maximum stress of solder joint is 42.8MPa and its thermal fatigue life is 6376 cycles.
Keywords
electronic equipment testing; fatigue testing; solders; stress analysis; thermal analysis; thermal stress cracking; transient analysis; CPU module; solder joint thermal fatigue life analysis; temperature load; temperature shock test; transient thermal analysis; Fatigue; Soldering; Solid modeling; Stress; Thermal analysis; Thermal stresses; Transient analysis; thermal analysis; thermal fatigue life; thermal stress analysis; transient;
fLanguage
English
Publisher
ieee
Conference_Titel
Prognostics and System Health Management Conference (PHM-2014 Hunan), 2014
Conference_Location
Zhangiiaijie
Print_ISBN
978-1-4799-7957-8
Type
conf
DOI
10.1109/PHM.2014.6988135
Filename
6988135
Link To Document