Title :
The application of transient thermal analysis in solder joint thermal fatigue life analysis
Author :
Xianglei Kong ; Fengming Lu ; Weili Li
Author_Institution :
China Aero Poly-Technol. Establ., Beijing, China
Abstract :
In this paper, a method of solder joint thermal fatigue life analysis using transient thermal analysis is introduced, and also a case study of temperature shock test to an CPU module. The results show that this method obtained the temperature load under actual use, which is closer to engineering problems. The module´s maximum temperature variation range is 50D-132D. Under the temperature load, the maximum stress of solder joint is 42.8MPa and its thermal fatigue life is 6376 cycles.
Keywords :
electronic equipment testing; fatigue testing; solders; stress analysis; thermal analysis; thermal stress cracking; transient analysis; CPU module; solder joint thermal fatigue life analysis; temperature load; temperature shock test; transient thermal analysis; Fatigue; Soldering; Solid modeling; Stress; Thermal analysis; Thermal stresses; Transient analysis; thermal analysis; thermal fatigue life; thermal stress analysis; transient;
Conference_Titel :
Prognostics and System Health Management Conference (PHM-2014 Hunan), 2014
Conference_Location :
Zhangiiaijie
Print_ISBN :
978-1-4799-7957-8
DOI :
10.1109/PHM.2014.6988135
