Failure analysis for electromagnetic relay contacts adhesion by using XES

Failure analysis is a vital tool used in the development of new products and for the improvement of existing products. And electromagnetic relay is indispensable and widely used in automatic electrical system, which has complex special structure and every component might fail. The failure analysis for electromagnetic relay have a series of methods applying for a number of failure models. The different failure models and failure mechanism of electromagnetic relay have been listed. Then a failure analysis process is proposed for the most common one, contacts adhesion. X-ray emission spectroscopy test is an important step in this process. It can help to observe more detail about morphology. After theoretical analysis, an actual case of failure analysis for electromagnetic relay contacts adhesion by using XES is presented, showing the feasibility and validity of the process. The failure mechanism is also analyzed. At last, some suggestions for improving reliability and avoiding contacts adhesion are given.