• DocumentCode
    1769137
  • Title

    System-on-chip considerations for CMOS fluidic and biointerface applications

  • Author

    Datta-Chaudhuri, Timir ; Abshire, Pamela ; Smela, Elisabeth

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Firstpage
    2009
  • Lastpage
    2012
  • Abstract
    CMOS chips are increasingly used for direct sensing and interfacing with fluidic and biological systems. CMOS circuits for sample acquisition, signal processing, and readout have been integrated with various sensors to form complex biosystems-on-chip. However, distinct and vexing technical challenges arise from the disparate requirements of biosensors and integrated circuits. From the perspective of integrated circuits, direct CMOS biosensing creates challenges in: packaging; materials selection; physical design constraints due to topography; MEMS post-processing of CMOS die; energy and power limitations; and transfer and processing of signals. From the perspective of biology, direct CMOS biosensing creates challenges in: fluidic integration; electrochemical effects; biocompatibility; environmental maintenance and surface treatments to support cell health and function; and optical assessment of opaque samples. We will describe these challenges and review lessons learned.
  • Keywords
    CMOS integrated circuits; bioMEMS; biomedical electronics; biomedical materials; biosensors; microfluidics; signal processing equipment; surface treatment; system-on-chip; CMOS die; CMOS fluidic application; MEMS postprocessing; biocompatibility; biointerface application; biosystems-on-chip; direct CMOS biosensing; direct sensing; electrochemical effects; environmental maintenance; fluidic integration; sample acquisition; signal processing; surface treatments; system-on-chip consideration; CMOS integrated circuits; Materials; Microfluidics; Packaging; Sensors; Surface treatment; biosensor; lab on chip; microfluidic; system on chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
  • Conference_Location
    Melbourne VIC
  • Print_ISBN
    978-1-4799-3431-7
  • Type

    conf

  • DOI
    10.1109/ISCAS.2014.6865558
  • Filename
    6865558