DocumentCode
1769137
Title
System-on-chip considerations for CMOS fluidic and biointerface applications
Author
Datta-Chaudhuri, Timir ; Abshire, Pamela ; Smela, Elisabeth
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
fYear
2014
fDate
1-5 June 2014
Firstpage
2009
Lastpage
2012
Abstract
CMOS chips are increasingly used for direct sensing and interfacing with fluidic and biological systems. CMOS circuits for sample acquisition, signal processing, and readout have been integrated with various sensors to form complex biosystems-on-chip. However, distinct and vexing technical challenges arise from the disparate requirements of biosensors and integrated circuits. From the perspective of integrated circuits, direct CMOS biosensing creates challenges in: packaging; materials selection; physical design constraints due to topography; MEMS post-processing of CMOS die; energy and power limitations; and transfer and processing of signals. From the perspective of biology, direct CMOS biosensing creates challenges in: fluidic integration; electrochemical effects; biocompatibility; environmental maintenance and surface treatments to support cell health and function; and optical assessment of opaque samples. We will describe these challenges and review lessons learned.
Keywords
CMOS integrated circuits; bioMEMS; biomedical electronics; biomedical materials; biosensors; microfluidics; signal processing equipment; surface treatment; system-on-chip; CMOS die; CMOS fluidic application; MEMS postprocessing; biocompatibility; biointerface application; biosystems-on-chip; direct CMOS biosensing; direct sensing; electrochemical effects; environmental maintenance; fluidic integration; sample acquisition; signal processing; surface treatments; system-on-chip consideration; CMOS integrated circuits; Materials; Microfluidics; Packaging; Sensors; Surface treatment; biosensor; lab on chip; microfluidic; system on chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on
Conference_Location
Melbourne VIC
Print_ISBN
978-1-4799-3431-7
Type
conf
DOI
10.1109/ISCAS.2014.6865558
Filename
6865558
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