• DocumentCode
    1769209
  • Title

    Steady-state thermal analysis and layout optimization of DC/DC converter

  • Author

    Cheng Gao ; Haitian Liu ; Jiaoying Huang ; Shenglong Diao

  • Author_Institution
    Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China
  • fYear
    2014
  • fDate
    24-27 Aug. 2014
  • Firstpage
    405
  • Lastpage
    409
  • Abstract
    DC/DC converters are widely used in industrial, aerospace and other fields. The reliability of DC/DC converters is very important for the whole electronic system. Overheat is the key factor infecting the reliability of DC/DC converters because of the power density of the device. Three-dimensional thermal analysis modules include heat distribution analysis and thermal stress analysis at 25 °C in this paper. In order to obtain power module temperature field contours at different temperature levels, a simplified 3D model of the power module was built, and steady-state thermal analysis was completed. The layout of the converter is optimized to reduce and balance heat distribution according to analysis results. The simulation results indicate that rational distribution of the power supply module can improve the reliability of DC/DC converters significantly.
  • Keywords
    DC-DC power convertors; optimisation; power supply circuits; power system reliability; thermal stresses; DC-DC converter layout optimization; DC-DC converter reliability; heat distribution reduction; overheat; power density; power module 3D model; power supply module rational distribution; steady-state thermal analysis; temperature 25 degC; thermal stress analysis; Finite element analysis; Heating; Load modeling; Steady-state; Substrates; Temperature distribution; Thermal analysis; DC/DC converters; layout optimization; reliability; steady-state thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Prognostics and System Health Management Conference (PHM-2014 Hunan), 2014
  • Conference_Location
    Zhangiiaijie
  • Print_ISBN
    978-1-4799-7957-8
  • Type

    conf

  • DOI
    10.1109/PHM.2014.6988203
  • Filename
    6988203