DocumentCode
1769726
Title
How much time does FET scaling have left?
Author
Mamaluy, D. ; Gao, X. ; Tierney, Brian
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2014
fDate
3-6 June 2014
Firstpage
1
Lastpage
2
Abstract
The ultimate end of CMOS scaling was predicted almost immediately after the now ubiquitous technology was invented by Frank Wanlass in 1963 [1]. Indeed, many possible limitations to downscaling were discussed in the 1970s, 80s, and 90s [2]. In 2003, Zhirnov et al. [3] estimated the minimal feature size of a “binary logic switch” to be around 1.5nm, based on the Heisenberg uncertainty and Landauer principles. Since then, there have been many papers [2,4,5] discussing the likely end of CMOS scaling due to lithographical, power-thermal, material, and other technological, as opposed to fundamental physical, limitations. In this work, we compute the device switching energy, CgVg2, for several representative FinFET/MuGFET devices, and explore the role of this quantity as a fundamental physical scaling limitation, which we predict will occur around 2030. In doing so, ITRS downscaling projection data [6] is utilized for reference. MuGFET switching energies are plotted as the blue curve in Fig. 1, in units of 100kBT (T=300K), as FET gate lengths are scaled to 6-nm and below. The inset of Fig. 1 represents our extrapolation of ITRS data. This new way of plotting switching energy reveals that as gate lengths arescaled below about 5nm, the switching energy approaches that of thermal fluctuations.
Keywords
CMOS integrated circuits; MOSFET circuits; CMOS scaling; FET gate lengths; FET scaling; FinFET-MuGFET devices; Heisenberg uncertainty; ITRS downscaling projection data; Landauer principles; binary logic switch; device switching energy; size 6 nm; thermal fluctuations; ubiquitous technology; FinFETs; Fluctuations; Laboratories; Logic gates; Silicon; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Electronics (IWCE), 2014 International Workshop on
Conference_Location
Paris
Type
conf
DOI
10.1109/IWCE.2014.6865875
Filename
6865875
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