DocumentCode
1770849
Title
Micro systems for sustainable society
Author
Esashi, Masayoshi
Author_Institution
World Premier Int. Res. Center Adv. Inst. for Mater. Res. (WPI-AIMR), Tohoku Univ., Sendai, Japan
fYear
2014
fDate
19-20 June 2014
Firstpage
1
Lastpage
2
Abstract
Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor, electron source and other value-added devices.
Keywords
adhesive bonding; large scale integration; microfabrication; micromechanical devices; wafer bonding; wafer level packaging; LSI wafer; carrier wafer; electron source; heterogeneous components; microsystem fabrication; piezoelectric switch; resonator; sustainable society; tactile sensor; value-added devices; versatile heterogeneous integration; wafer level adhesive bonding; wafer level packaging; Bonding; Large scale integration; Micromechanical devices; Microswitches; Surface acoustic waves; Tactile sensors; MEMS; Micro system; adhesive bonding; hetero-integration; wafer level packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
Conference_Location
Kyoto
Print_ISBN
978-1-4799-3614-4
Type
conf
DOI
10.1109/IMFEDK.2014.6867043
Filename
6867043
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