DocumentCode
1770865
Title
Characteristics of a microbridge type MEMS sensor for the thermal conductivity measurement of gases by a steady state method
Author
Fujii, Kenichi ; Muraoka, S. ; Omatu, Sigeru ; Yano, M.
Author_Institution
Osaka Inst. of Technol., Osaka, Japan
fYear
2014
fDate
19-20 June 2014
Firstpage
1
Lastpage
2
Abstract
Thermal conductivity λ of gases was successfully measured by a simple steady state method using a microbridge type MEMS sensor fabricated on a Si substrate. The sensor consisted of a hot wire with two adjacent thermocouples on the surface of a SiO2 microbridge. The temperature increase of the microbridge was measured by supplying step-like electrical power Q to the hot wire. Due to the small heat capacity of the microbridge, the temperature increased to a saturated value ΔT within several tens of millisecond. In moving gas, the difference of the ΔT between upstream and downstream thermocouples gives the flow velocity. In static gas, this difference intrinsically becomes zero, and the heat flow QG from the hot wire to the surrounding gas is calculated using the Q to yield the same ΔT for different gases with known λ. Once QG is obtained, the λ of any unknown gases can be estimated by measuring the Q to yield the same ΔT.
Keywords
chemical variables measurement; microfabrication; microsensors; silicon compounds; thermal conductivity measurement; thermocouples; Si; SiO2; adjacent thermocouples; flow velocity; gas measurement; hot wire; microbridge type MEMS sensor characteristics; small heat capacity; steady state method; step-like electrical power; thermal conductivity measurement; Films; Gases; Heating; Micromechanical devices; Silicon; Steady-state; Wires; air-bridge by MEMS; flow velocity; hot wire method; thermal condudcitivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
Conference_Location
Kyoto
Print_ISBN
978-1-4799-3614-4
Type
conf
DOI
10.1109/IMFEDK.2014.6867052
Filename
6867052
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