• DocumentCode
    1770865
  • Title

    Characteristics of a microbridge type MEMS sensor for the thermal conductivity measurement of gases by a steady state method

  • Author

    Fujii, Kenichi ; Muraoka, S. ; Omatu, Sigeru ; Yano, M.

  • Author_Institution
    Osaka Inst. of Technol., Osaka, Japan
  • fYear
    2014
  • fDate
    19-20 June 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Thermal conductivity λ of gases was successfully measured by a simple steady state method using a microbridge type MEMS sensor fabricated on a Si substrate. The sensor consisted of a hot wire with two adjacent thermocouples on the surface of a SiO2 microbridge. The temperature increase of the microbridge was measured by supplying step-like electrical power Q to the hot wire. Due to the small heat capacity of the microbridge, the temperature increased to a saturated value ΔT within several tens of millisecond. In moving gas, the difference of the ΔT between upstream and downstream thermocouples gives the flow velocity. In static gas, this difference intrinsically becomes zero, and the heat flow QG from the hot wire to the surrounding gas is calculated using the Q to yield the same ΔT for different gases with known λ. Once QG is obtained, the λ of any unknown gases can be estimated by measuring the Q to yield the same ΔT.
  • Keywords
    chemical variables measurement; microfabrication; microsensors; silicon compounds; thermal conductivity measurement; thermocouples; Si; SiO2; adjacent thermocouples; flow velocity; gas measurement; hot wire; microbridge type MEMS sensor characteristics; small heat capacity; steady state method; step-like electrical power; thermal conductivity measurement; Films; Gases; Heating; Micromechanical devices; Silicon; Steady-state; Wires; air-bridge by MEMS; flow velocity; hot wire method; thermal condudcitivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-3614-4
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2014.6867052
  • Filename
    6867052