DocumentCode :
1770881
Title :
Conduction-type dependence of thermal oxidation rate on SiC(0001)
Author :
Kobayashi, Takuma ; Suda, Jun ; Kimoto, Tsunenobu
Author_Institution :
Dept. of Electron. Sci. & Eng., Kyoto Univ., Kyoto, Japan
fYear :
2014
fDate :
19-20 June 2014
Firstpage :
1
Lastpage :
2
Abstract :
The conduction-type dependent thermal oxidation rate in SiC was discovered. The oxidation was performed for SiC(0001) with nitrogen doping (n-type) in the range from 2.0×1016 cm-3 to 1.0×1019 cm-3, and aluminum doping (p-type) in the range from 2.0×1015 cm-3 to 1.0×1019 cm-3, exhibiting a clear dependence. For n-type SiC the oxide thickness increases for higher doping density, and for p-type the thickness decreases. Note that in the case of Si oxidation, there exists very little difference of oxidation rate between the conduction types in such low doping density, and the dependence is peculiar to SiC. The authors speculate the difference originates from the difference in carrier (electron/hole) density during the oxidation, which can reasonably explain the difference in the oxidation rate between Si and SiC.
Keywords :
aluminium; electron density; hole density; nitrogen; oxidation; semiconductor doping; silicon compounds; wide band gap semiconductors; SiC(0001) surface; SiC:Al; SiC:N; aluminum doping; carrier density; conduction-type dependence; doping density; electron-hole density; n-type SiC materials; n-type doping; nitrogen doping; p-type doping; thermal oxidation rate; Charge carrier processes; Dielectrics; Doping; Oxidation; Silicon; Silicon carbide; Thermal conductivity; Silicon carbide (SiC); conduction-type dependence; doping dependence; oxidation; silicon dioxide (SiO2); spectroscopic ellipsometry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-3614-4
Type :
conf
DOI :
10.1109/IMFEDK.2014.6867060
Filename :
6867060
Link To Document :
بازگشت