DocumentCode :
1772829
Title :
Combining fault tolerance and self repair at minimum cost in power and hardware
Author :
Koal, Tobias ; Scholzel, Mario ; Vierhaus, Heinrich T.
Author_Institution :
Comput. Eng. Group, Brandenburg Univ. of Technol. Cottbus-Senftenberg, Brandenburg, Germany
fYear :
2014
fDate :
23-25 April 2014
Firstpage :
153
Lastpage :
158
Abstract :
Large-scale integrated circuits and systems fabricated in nano-technologies exhibit new and enhanced fault properties which limit both their reliability and their life time. Transient fault effects have found most attention so far. They must be handled by on-line check and fault compensation based on duplication and triplication, typically at a significant amount of extra power. Such techniques are not suitable for life time extension, since their redundant elements all undergo wear-out effects in hot operation. Repair technologies that perform a process of system re-organization and introduction of cold redundancy may extend system life time, but they are too slow to catch and correct transient and permanent fault effects in hot operation. The essential task therefore remains to find methods and architectures that will provide on-line check in combination with self repair techniques at a minimum cost in extra power.
Keywords :
fault tolerance; integrated circuit economics; integrated circuit reliability; large scale integration; nanofabrication; cold redundancy introduction; enhanced fault property; fault compensation; fault tolerance; large-scale integrated circuits; life time extension; nanotechnology; on-line check; permanent fault effect; repair technology; self-repair technique; system re-organization; transient fault effect; transient fault effects; wear-out effects; Circuit faults; Clocks; Flip-flops; Maintenance engineering; Timing; Transient analysis; Tunneling magnetoresistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Diagnostics of Electronic Circuits & Systems, 17th International Symposium on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4799-4560-3
Type :
conf
DOI :
10.1109/DDECS.2014.6868780
Filename :
6868780
Link To Document :
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