DocumentCode :
1773284
Title :
Modeling and experimental validation of the mechanical behavior of pressboard
Author :
Girlanda, O. ; Tjahjanto, D.D. ; Ostlund, Stefan ; Ask, A. ; Forslin, J. ; Schmidt, L.E.
Author_Institution :
ABB Corp. Res., Vasteras, Sweden
fYear :
2014
fDate :
8-11 June 2014
Firstpage :
203
Lastpage :
207
Abstract :
High density (HD) pressboard is an essential element in power transformers combining good electrical insulation properties with effective mechanical characteristics that well suit design requirements of power transformers. In order to ensure a correctly functioning transformer, it is therefore very important to characterize and to understand the mechanical properties of pressboard under different operating conditions. Pressboard is composed of natural polymeric chains, whose mechanical properties are affected by moisture and temperature. Moreover, temperature and moisture conditions in power transformers vary throughout manufacturing process and service/operation life-time. An accurate definition of the mechanical properties is, therefore, necessary. The present article focuses on the effect of different combinations of temperature/moisture and mechanical load on the deformation behavior of HD pressboard samples. A mechanical constitutive model is developed for finite element (FEM) simulation based on a viscoelastic- viscoplastic material description. Special attention is given on the complex through-thickness deformation behavior of HD pressboard. Thorough analyses are performed based on the comparisons between the results of experimental characterization and FEM modeling and simulations. The good agreement between experimental and modeling results shows a great potential for application in mechanical design of transformer insulation.
Keywords :
finite element analysis; polymers; power transformer insulation; viscoelasticity; viscoplasticity; complex through-thickness deformation; electrical insulation; finite element simulation; high density pressboard; mechanical load; moisture effect; natural polymeric chain; power transformer; pressboard deformation; pressboard mechanical behavior; temperature effect; viscoelastic material description; viscoplastic material description; Moisture; Plastics; Strain; Temperature distribution; Compressbility test; Mechanical properties; Pressboard; Temperature-moisture sensitivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2014
Conference_Location :
Philadelphia, PA
Print_ISBN :
978-1-4799-2787-6
Type :
conf
DOI :
10.1109/EIC.2014.6869376
Filename :
6869376
Link To Document :
بازگشت