• DocumentCode
    1773319
  • Title

    Comparative study of synthetic and natural clay filled PP films under surface discharges

  • Author

    Dhara, Rohitha ; Rab, Md Afzalur ; Basappa, Prathap

  • Author_Institution
    Insulation Evaluation & Design Lab., Norfolk State Univ., Norfolk, VA, USA
  • fYear
    2014
  • fDate
    8-11 June 2014
  • Firstpage
    320
  • Lastpage
    323
  • Abstract
    It is known from literature that addition of small wt% of nanofillers into pure polypropylene matrix improves the electrical characteristics by many folds. This study is intended to compare the effect of natural and synthetic nanocomposites on the PD resistance when introduced in small concentrations in the base PP material. This work investigates the effect of type of nanofiller and its content on the PD resistance of PP films under surface discharges. The sample aging is performed under a voltage that constantly increases with time (Ramp voltage) to minimize the effect of space charge redistribution during the aging process on the sample PD behavior and PD characteristics. Samples with 0, 2, 6 wt% of natural organoclay nanocomposites and 2, 4, 8 wt% of synthetic organo clay nanocomposites are considered for this purpose. These samples are subjected to surface PDs and the degree of surface erosion is quantified by Optical microscope and surface Profilometer.
  • Keywords
    ageing; clay; nanocomposites; optical microscopes; organic insulating materials; partial discharges; surface discharges; PD resistance; aging process; electrical characteristics; nanofillers; natural clay filled PP films; natural organoclay nanocomposites; optical microscope; polypropylene matrix; space charge redistribution; surface discharges; surface erosion; surface profilometer; synthetic clay filled PP films; synthetic organoclay nanocomposites; Aging; Discharges (electric); Nanocomposites; Partial discharges; Surface discharges; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2014
  • Conference_Location
    Philadelphia, PA
  • Print_ISBN
    978-1-4799-2787-6
  • Type

    conf

  • DOI
    10.1109/EIC.2014.6869401
  • Filename
    6869401