DocumentCode
1773319
Title
Comparative study of synthetic and natural clay filled PP films under surface discharges
Author
Dhara, Rohitha ; Rab, Md Afzalur ; Basappa, Prathap
Author_Institution
Insulation Evaluation & Design Lab., Norfolk State Univ., Norfolk, VA, USA
fYear
2014
fDate
8-11 June 2014
Firstpage
320
Lastpage
323
Abstract
It is known from literature that addition of small wt% of nanofillers into pure polypropylene matrix improves the electrical characteristics by many folds. This study is intended to compare the effect of natural and synthetic nanocomposites on the PD resistance when introduced in small concentrations in the base PP material. This work investigates the effect of type of nanofiller and its content on the PD resistance of PP films under surface discharges. The sample aging is performed under a voltage that constantly increases with time (Ramp voltage) to minimize the effect of space charge redistribution during the aging process on the sample PD behavior and PD characteristics. Samples with 0, 2, 6 wt% of natural organoclay nanocomposites and 2, 4, 8 wt% of synthetic organo clay nanocomposites are considered for this purpose. These samples are subjected to surface PDs and the degree of surface erosion is quantified by Optical microscope and surface Profilometer.
Keywords
ageing; clay; nanocomposites; optical microscopes; organic insulating materials; partial discharges; surface discharges; PD resistance; aging process; electrical characteristics; nanofillers; natural clay filled PP films; natural organoclay nanocomposites; optical microscope; polypropylene matrix; space charge redistribution; surface discharges; surface erosion; surface profilometer; synthetic clay filled PP films; synthetic organoclay nanocomposites; Aging; Discharges (electric); Nanocomposites; Partial discharges; Surface discharges; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2014
Conference_Location
Philadelphia, PA
Print_ISBN
978-1-4799-2787-6
Type
conf
DOI
10.1109/EIC.2014.6869401
Filename
6869401
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