• DocumentCode
    1773345
  • Title

    Numerical thermo-mechanical stress analysis for HVDC cables

  • Author

    Huang, Z.Y. ; Pilgrim, J.A. ; Lewin, P.L. ; Swingler, S.G. ; Tzemis, G.

  • Author_Institution
    Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
  • fYear
    2014
  • fDate
    8-11 June 2014
  • Firstpage
    387
  • Lastpage
    391
  • Abstract
    Calculating the current rating of paper insulated HVDC cables under low ambient temperatures can require additional mechanical considerations. Under rapid cable heating or cooling processes, an extremely high mechanical stress or a rapid pressure drop can develop due to the strong impregnant thermal expansion or contraction respectively. This may cause plastic deformation of the sheath or the creation of voids. This paper demonstrates the importance of this thermo-mechanical constraint through the application of finite element modelling techniques which permit a coupling of the thermal and mechanical properties within the cable. The results show that the FEA technique can be fully applied to analyze the internal thermo-mechanical stress distribution of the cable and calculate the resulting mechanical stress-limited rating, which provides an alternative to an analytical method previously developed by the same author.
  • Keywords
    HVDC power convertors; HVDC power transmission; finite element analysis; impregnated insulation; paper; plastic deformation; power cable insulation; thermal analysis; thermal expansion; FEA technique; cooling processes; finite element modelling techniques; impregnant thermal contraction; impregnant thermal expansion; low ambient temperatures; mechanical properties; paper insulated HVDC cables; plastic deformation; rapid cable heating; rapid pressure drop; thermal properties; thermomechanical stress analysis; Mathematical model; Power cable insulation; Power cables; Stress; Thermal expansion; Thermal stresses; HVDC transmission; finite element analysis; thermal expansion; underwater cables;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2014
  • Conference_Location
    Philadelphia, PA
  • Print_ISBN
    978-1-4799-2787-6
  • Type

    conf

  • DOI
    10.1109/EIC.2014.6869415
  • Filename
    6869415