DocumentCode :
1773384
Title :
SF6 contaminated by SO2: Dielectric strength and influence on sealing materials
Author :
Wilhelm, H.M. ; Mattoso, Marta ; Gomez, Neffer A. G. ; Fernandes, Paula Odete ; Feitosa, Leandro ; Cruz, Vanderlei ; Meyer, L.H.
Author_Institution :
Diagno Mater. e Meio Ambiente, Curitiba, Brazil
fYear :
2014
fDate :
8-11 June 2014
Firstpage :
478
Lastpage :
482
Abstract :
This work investigates the influence of the presence of SO2 in SF6 regarding its breakdown voltage. A test chamber was built to accommodate a gas pressure of 2 bar, with a pair of electrodes inside, separated by a variable distance. The SO2 concentration in SF6 was 0,5 and 500 ppm. Preliminary results indicate that the influence of the presence of SO2 in SF6 regarding the breakdown strength is minimal. The effect of SO2 was also investigated on the switchgear sealing. For this purpose a metal chamber was designed and built to test pure SF6 and mixtures of SF6 and SO2 under 20 bar pressure, at 120 °C, for two months with different sealing materials, in order to evaluate the relative degradation of these materials. Preliminary results indicate that these mixtures can affect the mechanical resistance of the sealing material.
Keywords :
electric strength; electrodes; gas insulated switchgear; gaseous insulation; inorganic compounds; insulator contamination; sealing materials; sulphur compounds; SF6; SO2; breakdown voltage; contamination; dielectric strength; electrode; gas pressure; mechanical resistance; pressure 2 bar; relative degradation; switchgear sealing material; temperature 120 C; test ehamber; Aging; Combustion; Engines; Europe; Materials; Sulfur hexafluoride; Zinc; Accelerated aging; Contamination; Degradation; Dielectric measurement; Gas insulation; Greenhouse gases; Power system faults; Rubber; Sealants; Sulfur hexafluoride;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2014
Conference_Location :
Philadelphia, PA
Print_ISBN :
978-1-4799-2787-6
Type :
conf
DOI :
10.1109/EIC.2014.6869434
Filename :
6869434
Link To Document :
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